The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

A gasket material comprising a crosslinked fluororubber layer having a micro-hardness of 5 to 25 formed on a metal plate using a fluororubber composition comprising 30 to 70 parts by weight of carbon black having a CTAB specific surface area of 3 to 34 m.sup.2/g, and 5 to 15 parts by weight of hydrated amorphous silicon dioxide having a BET specific surface area of 35 to 220 m.sup.2/g, based on 100 parts by weight of fluororubber, wherein the total amount of carbon black and hydrated amorphous silicon dioxide is 80 parts by weight or less.

Provided are two-component curable compositions and methods thereof. The composition includes a base component comprised of a curable resin and a first compressible filler dispersed therein. The composition further includes a curative component comprised of a curing agent and a second compressible filler dispersed therein. The base and curative components react with each other upon mixing to provide a crosslinked network. When used with automated metering pumps, the compressibility of the base and curing agent components can be matched, allowing for a constant mix ratio despite variability in applied pressure.

Polysulfide compositions having a polyether synergist are disclosed. Polysulfide compositions that contain polyether synergists exhibit a rapid onset of cure and have acceptable final properties. The polysulfide compositions can be used as sealants.

A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

The present invention relates to an encapsulant capable of reducing potential-induced degradation (PID). The encapsulant is used to seal a solar cell to form a photovoltaic module, in which silica gel is dispersed in the encapsulant as a sodium ion adsorbent. Since the silica gel that is highly transparent is used as the sodium ion adsorbent, it is possible to prevent PID attributable to sodium ions and to prevent deterioration in photovoltaic efficiency of the photovoltaic module. Since the silica gel has a high specific surface area, it is possible to adsorb sodium ions with a small amount of the silica gel.

An epoxy resin composition of the present invention includes an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator, in which a maximum exothermic peak temperature in a DSC curve of the epoxy resin composition obtained in a case of elevating a temperature from 30 C. to 200 C. under a condition of a temperature elevating rate of 10 C./min using a differential scanning calorimeter is equal to or higher than 80 C. and equal to or lower than 145 C.

A hydrophobic dielectric sealing material is provided that is especially suitable for use in extreme environments such as for enabling downhole electrical feedthrough integrated logging tools reliable operation, especially, in a water or water-mud filled wellbore as first scenario or in moisture-rich oil-mud filled wellbores. In some embodiments, a hydrophobic dielectric sealing material may include: H.sub.3BO.sub.3 10-60 mol %; Bi.sub.2O.sub.3 10-50 mol %; MO 10-50 mol %; SiO.sub.2 0-15 mol %; and optionally one or more rare earth oxides 0-5 mol %. A method for making hydrophobic sealing material includes selecting water insoluble raw materials, form tetragonal phase dominated phase, and enlarge band-gap with wide-band-gap material. The morphology of the sealing material is preferably a tetrahedral phase dominated covalent bond network for obtaining high electrical insulation resistance, dielectric strength and hydrophobicity, and high mechanical strength in against downhole 30,000 PSI/300 C. water-based hostile environments.

An epoxy resin composition of the present invention includes an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator, in which a maximum exothermic peak temperature in a DSC curve of the epoxy resin composition obtained in a case of elevating a temperature from 30 C. to 200 C. under a condition of a temperature elevating rate of 10 C./min using a differential scanning calorimeter is equal to or higher than 80 C. and equal to or lower than 145 C.

Provided are two-component curable compositions and methods thereof. The composition includes a base component comprised of a curable resin and a first compressible filler dispersed therein. The composition further includes a curative component comprised of a curing agent and a second compressible filler dispersed therein. The base and curative components react with each other upon mixing to provide a crosslinked network. When used with automated metering pumps, the compressibility of the base and curing agent components can be matched, allowing for a constant mix ratio despite variability in applied pressure.