C09K2200/0247

SEALING APPARATUS
20250215200 · 2025-07-03 ·

A sealing apparatus is provided. The sealing apparatus is arranged between two members facing each other for sealing a space between the two members. The sealing apparatus comprises a sealing body in contact with the space, in which the sealing body has a tensile strength of 10 MPa or more measured in accordance with the provisions of JIS K 6251: 2017, an elongation at break of 200% or more measured in accordance with the provisions of JIS K 6251: 2017, a TR10 temperature of 40 C. or lower in a low-temperature elastic recovery test, measured in accordance with the provisions of JIS K 6261-4: 2017, and a compression set at 100 C. with an elapsed time of 70 hours in a shape of a G25 O-ring as described in the provisions of JIS B 2401-1: 2012, measured in accordance with the provisions of JIS K 6262: 2013, of 40% or less.

Seal member

This seal member is a cured product of a silicone rubber composition that comprises a silicone rubber and silica particles, and has multiple insertion holes into which counterpart members are inserted; and this seal member satisfies the following conditions (a) to (d). (a) If X (parts by mass) is the content of the silica particles relative to 100 parts by mass of a base polymer of the silicone rubber, (elastic recovery rate (%))/(X (parts by mass)) is from 3.6 to 9.6. (b) The type A durometer hardness is from 15 to 30. (c) The tensile strength at break is 2.1 MPa or more. (d) The coefficient of kinetic friction of the surfaces of the insertion holes is 2.5 or less.

Curable Compositions Comprising At Least One Silane-Modified Polymer

The invention relates to adhesive, sealant, and/or coating materials comprising a curable composition and the use thereof, the curable composition comprising I. at least one silane-modified polymer obtainable by reacting (A) at least one polymer terminated with amine groups at both ends, which polymer is selected from polyester, polyether polyols, poly(meth)acrylates, polyolefins, and/or copolymers of the aforementioned and has a molecular weight M.sub.w between 250 and 10,000 Dalton, (B) at least one cycloaliphatic diisocyanate compound, and (C) at least one secondary aminosilane with two hydrolysable groups; II. surface treated silica; III. surface treated calcium carbonate; IV. at least one additional aminosilane; V. optionally, at least one adhesion promoter; VI. optionally, at least one pigment; VII. optionally, at least one catalyst; VIII. optionally, at least one plasticizer.

Semiconductor production device sealing material

A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 m or more and 20 m or less.

Ultra-white silica-based filler

An ultra-white granular silica-based filler comprises at least 99.5 wt. % silica, wherein the crystal structure of the silica is such that the silica-based filler comprises 40 to 80 wt. % cristobalite, 1 to 25 wt. % tridymite, 2-60 wt. % quartz and <5 wt. % amorphous silica, wherein the temperature of the ultra-white granular silica-based filler is no higher than 50 C. and further wherein the ultra-white granular silica-based filler exhibits an L* value in the CIELAB color space of 95-98. In addition, an ultra-white powder filler is obtained by milling, grinding or comminuting the ultra-white granular silica-based filler. The ultra-white powder filler exhibits an L* value in the CIELAB color space of 95-98.5.

METAL OXIDE PARTICLE MATERIAL, METHOD FOR PRODUCING SAME, SLURRY COMPOSITION, RESIN COMPOSITION, AND FILLER FOR SEALING MATERIAL FOR SEMICONDUCTOR PACKAGE
20260125538 · 2026-05-07 · ·

A metal oxide particle material contains a metal oxide as a main component and has: a D50 of 1.0 m or more and 5.0 m or less, the D50 being obtained by measuring a laser diffraction particle size distribution; a specific surface area of 1.0 m.sup.2/g or more and 30 m.sup.2/g or less; a coarse particle content of 300 ppm or less, the coarse particle content being a content of coarse particles having a particle diameter of 5 m or more; and a hollow particle content of 4000 particles/10 mg or less, the hollow particle content being a content of hollow particles having a particle diameter of 5 m or more. When a resin material is filled with the metal oxide particle material at a solid concentration of 60% by mass, a resultant resin composition has a viscosity of 170 Pa.Math.s or less (at a shear velocity of 1 s.sup.1).