An epoxy resin composition of the present invention includes an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator, in which a maximum exothermic peak temperature in a DSC curve of the epoxy resin composition obtained in a case of elevating a temperature from 30 C. to 200 C. under a condition of a temperature elevating rate of 10 C./min using a differential scanning calorimeter is equal to or higher than 80 C. and equal to or lower than 145 C.

Provided are a liquid epoxy resin sealing material capable of suppressing occurrence of fillet cracks generated when an underfill cured product is left under high temperature aerobic conditions, and a semiconductor device using the liquid epoxy resin sealing material. More specifically, provided are the liquid epoxy resin sealing material containing (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler and (D) an antioxidant agent represented by the following formula, wherein 0.5 to 10 parts by mass of (D) the antioxidant agent is contained based on a total of 100 parts by mass of (A) the epoxy resin and (B) the amine curing agent, and the semiconductor device using the liquid epoxy resin sealing material.

A curable epoxy composition includes an epoxy resin composition; a hardener composition comprising an aromatic dianhydride curing agent of the formula

##STR00001##

wherein T is O, S, SO.sub.2, SO, C.sub.yH.sub.2y wherein y is an integer from 1 to 5 or a halogenated derivative thereof, or OZO wherein Z is an aromatic C.sub.6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C.sub.1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof, and the aromatic dianhydride has a melting point of 220 C. or less; and at least one additional anhydride curing agent different from the aromatic dianhydride curing agent; and 0.1 to 5 wt % of a heterocyclic accelerator, wherein the heterocyclic accelerator comprises a substituted or unsubstituted C.sub.3-6 heterocycle comprising 1 to 4 ring heteroatoms, wherein each heteroatom is nitrogen, oxygen, phosphorus, silicon, or sulfur.

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):

##STR00001##

wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15 C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.

An epoxy resin composition of the present invention includes an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator, in which a maximum exothermic peak temperature in a DSC curve of the epoxy resin composition obtained in a case of elevating a temperature from 30 C. to 200 C. under a condition of a temperature elevating rate of 10 C./min using a differential scanning calorimeter is equal to or higher than 80 C. and equal to or lower than 145 C.

Provided are sealant compositions that include a first component and second component. The first component contains a polysulfide, a polythioether, or a copolymer or combination thereof containing pendant or terminal thiol groups, while the second in component contains an ethylenically-unsaturated compound and either the first or second component further contains a photoinitiator. Alternatively, the second component can contain a polyepoxide and either the first or second component can contain a photolatent base and a photosensitizer. The first or second component further contains a colorant that substantially reflects or substantially transmits light over the wavelength range from 350 nm to 500 nm. These compositions can provide cure-on-demand sealant formulations that comply with Class B sealant regulations on color, provide an acceptable depth of cure, and allow two-part mixing to be easily distinguishable.

A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.

A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

A material for gaskets is disclosed, wherein a metal surface coating layer, a primer layer and a rubber layer are formed, or a metal surface coating layer and a rubber layer are formed on at least a part of one side or both sides of a substrate formed of a metal plate sequentially from the metal plate side, and the metal surface coating layer comprises (A) one or more carbonates selected from the group consisting of Mg carbonate, Co carbonate, Zr carbonate, Mn carbonate, Ni carbonate, and Cu carbonate and (B) one or more selected from the group consisting of silica, alumina, zirconia, and titania.

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I): ##STR00001##
wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15 C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.