Provided is a curable organopolysiloxane composition from which highly heat-resistant cured products can be obtained, the curable organopolysiloxane composition comprising: (A) 100 parts by mass of a novel organopolysiloxane represented by formula (1)

##STR00001##

(R.sup.1 is an alkyl group or an alkoxy substituted alkyl group having 1 to 6 carbon atoms, R.sup.2 is a group selected from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and a group in which a portion of the hydrogen atoms of those groups is substituted with a halogen atom, Ar is an arylene group having 6 carbon atoms or more, a is 1 to 1,000, b is 1 to 5,000, and n is 1 to 3, the total of n in an unsubstituted or substituted alkoxysilyl group on both ends of the molecular chain being 3 or more); and (B) 0.01 to 10 parts by mass of a curing catalyst. Also provided are electrical and electronic components, a vehicle oil seal, a building sealant, etc. which use the cured product of the composition.

Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I)

-A.sub.n-RSiXYZ(I),

wherein A is a divalent or trivalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C.sub.1 to C.sub.8 alkyl, C.sub.1 to C.sub.8 alkoxy, C.sub.1 to C.sub.8 acyloxy groups and CH.sub.2NR wherein N is oxygen, nitrogen or sulfur, preferably oxygen, and R is selected from C.sub.1 to C.sub.8 alkyl groups, preferably a methyl group, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C.sub.1 to C.sub.8 alkoxy or C.sub.1 to C.sub.8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II)

##STR00001##

wherein R.sup.1 is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, R.sup.2 is same or different and is, independently from one another, selected from hydrocarbon residues having 1 to 12 carbon atoms, Ar is selected from aryl groups, and n is an integer selected from 3 to 9; and adhesive, sealant, or coating materials comprising the composition and use thereof.

Provided are: a thermosetting resin composition from which a molded body exhibiting little change in optical characteristics when exposed to high temperatures can be obtained, and which can be applied to various packaging processes; an organosilicon compound from which the composition can be achieved; and a molded body and an optical semiconductor device which are obtained using such a thermosetting resin composition.

The thermosetting resin composition includes: a compound that is selected from among organosilicon compounds (A) represented by Formula (1-1) or Formula (1-2); an organosilicon compound (B) that has a plurality of crosslinkable groups in its molecule and is other than the organosilicon compounds (A); and a hydrosilylation catalyst (C), in which the organosilicon compound (B) contains a compound that is crosslinkable with the organosilicon compounds (A).

A compound containing at least one hexahydrotriazine unit of formula (I) having at least one amidine or guanidine group and to the use thereof as a catalyst for the crosslinking of a functional compound, in particular a polymer including silane groups. The compound contains at least one hexahydrotriazine unit of formula (I) is producible in a simple process from readily available feedstocks, odorless at room temperature, non-volatile and largely non-toxic. The compound accelerates the crosslinking of functional polymers surprisingly well and by simple variation of the substituents is variable such that it has very good compatibility in different polymers as a result of which such compositions do not have a propensity for migration-based defects such as separation, exudation or substrate contamination.

A composition curing upon exposure to moisture comprises (A) one or more at least bifunctional silane compounds with at least two alkoxysilane groups, (B) at least one monofunctional silane compound with only one alkoxysilane group, and/or a partially condensed or bridged derivative thereof, and (C) at least one acid generator which, upon exposure to actinic radiation or heat, releases an acid. In addition, further additives (D) may be contained in the compositions according to the present invention. The composition is liquid at room temperature and, apart from the latent acid generator, does not contain any further catalysts for moisture-curing of alkoxysilanes. After activation of the acid generator the composition cures in the presence of moisture, while remaining liquid at room temperature in the presence of humidity over a period of at least 24 hours prior to activation of the acid generator. Furthermore, a method of joining or casting structural elements using the composition is described.

The present disclosure relates to self-sealing silicone sealant and/or gel compositions cured via a condensation cure chemistry and to their use subsequent to cure as puncture-resistant layers in any type of inflatable article, i.e. articles which take their functional shape after inflation with a suitable gas such as air. The present disclosure also relates to silicone materials, e.g. elastomers and/or gels obtained subsequent to curing said compositions designed to function as self-sealing tire puncture material, i.e. to seal puncture holes in the tread region of tires if/when punctured by a foreign body.

This dealcoholization room-temperature curable organopolysiloxane composition contains (A) a diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a hydrolyzable silyl group at both ends of the molecular chain, and has a coefficient of viscosity of 20-1,000,000 mPa.Math.s, (B) an organopolysiloxane which is a partial (co-)hydrolysis-condensation product of a hydrolyzable organosilane compound having one or more silicon atom-bonded alkenyl groups and 1-3 silicon atom-bonded alkoxy groups, per molecule, (C) a hydrolyzable organosilane compound having one or more phenylene backbones and two or more amino groups, per molecule, and/or a partial hydrolysis-condensation product thereof. The dealcoholization room-temperature curable organopolysiloxane composition has good curability and storage stability even when the composition does not contain a metal catalyst, is less toxic to the human body and is environmentally friendly, is cost-competitive, and has good rubber physical properties and adhesiveness after being cured.

The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.

The subject application relates to a silicone-based sealant that may be formed from a two-part forming mixture. The two-part forming mixture may include a first component and a second component that chemically reacts with the first component upon combination. The first component of the two-part forming mixture may include an amino silicone component, a filler composition, and a silane component. The second component may include an aldehyde component.