A heat-conductive silicone grease composition comprising (A) an organopolysiloxane in an amount of 20 to 90 parts by mass, (B) a non-silicone-type organic compound in an amount of 80 to 10 parts by mass (wherein the total amount of the components (A) and (B) is 100 parts by mass) and (C) a heat-conductive inorganic filler having an average particle diameter of 0.5 to 100 m in an amount of 200 to 2,000 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B), wherein the SP value of the non-silicone-type organic compound (B) is greater than that of the organopolysiloxane (A) (i.e., (B)>(A)), the value obtained by subtracting the SP value of the component (A) from the SP value of the component (B) is greater than 2, and the viscosity of the heat-conductive silicone grease composition is 50 to 1,000 Pa.Math.s at 25 C.

A composition for reducing friction or stiction of a surface is disclosed. The composition comprises at least one organosilane, at least one organophosphorus, or a combination of at least one organosilane and at least one organophosphorus. The composition further comprises at least one polymer. Methods of applying the composition to a surface are also disclosed. Non-limiting examples of surfaces to which the composition can be applied include metal, metal alloys, metal oxide, glass, ceramic, or plastic substrates, and combinations thereof. Articles comprising at least one surface having been treated with the composition are also disclosed. Non-limiting examples of such articles include windows, watches and watch bands, screens, monitors, high-touch surfaces, electronic products, housing for electronics, and combinations thereof. Such articles can also exhibit enhanced hydrophobicity and/or anti-corrosion properties compared to untreated articles.