Consumer and industrial 2-in-1 alkaline ware washing compositions providing both detergency and rinseability in a single cleaning composition are disclosed. Further benefits can be achieved with low levels of rinse aid surfactants in a rinse additive following the alkaline ware washing composition, including levels of rinse additive surfactant of about 500 ppm surfactant or less. Alkaline ware washing compositions and methods of using the same provide user-friendly, solid, ware washing compositions without the need for using a separate rinse aid composition.

Cleaning composition for hard surfaces are disclosed, particularly for cleaning hard surfaces stained with greasy burnt-on deposits such as frequently occur on stovetop and oven surfaces. Processes to manufacture the cleaning composition, as well as methods for their use are also disclosed.

The invention provides to a powdered composition of additives and a method of use thereof for increasing the visibility, potency and coverage of disinfectant solutions, such as bleach.

An antimicrobial cleaning composition having a pH of from about 9 to about 14 wherein the composition comprises a bispyridinium alkane antimicrobial active and the composition is substantially free of a quaternary ammonium antimicrobial active.

A photoresist-removing composition includes a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine not including a hydroxy group, and a monovalent alcohol. To manufacture a semiconductor device, a photoresist pattern may be formed on a substrate, and the photoresist-removing composition may then be applied to the photoresist pattern. To manufacture a semiconductor package, a photoresist pattern including a plurality of via holes may be formed on a substrate. A plurality of conductive posts including a metal may be formed inside the plurality of via holes, and the photoresist pattern may be removed by applying a photoresist-removing composition of the inventive concept to the photoresist pattern. A semiconductor chip may be adhered to the substrate between the respective conductive posts.

Powder and cast solid alkaline cleaning compositions are disclosed. Powders and/or solidification of a highly alkaline detergent composition are provided including sodium hydroxide beads and/or liquid and sodium carbonate in combination with water conditioning polymers. Methods of cleaning for soil removal of baked on, greasy soils, including those found in ovens, are also disclosed.

A wash fluid for use in an inkjet recording apparatus contains water, a coconut oil fatty acid surfactant, an organic deliquescent agent, a polyhydric alcohol, and a basic inorganic compound. The polyhydric alcohol is an alkanediol. The coconut oil fatty acid surfactant is contained in an amount of at least 0.01% by mass and no greater than 3.00% by mass. The organic deliquescent agent is contained in an amount of at least 0.10% by mass and no greater than 30.00% by mass.

Described herein are home care compositions (e.g., aqueous liquid compositions), which may be used as a hand dishwashing composition, comprising laureth sulfate having 1 moiety or less of an ethylene oxide group, alkyl aryl sulfonate, a blend of C.sub.9-11 branched primary alcohols, and an amine oxide or betaine amphoteric surfactant. Methods of making and using these compositions are also described.

The present invention relates to new alkaline, preferably highly alkaline, cleaning solutions comprising surfactants with improved stability and cleaning performance under such conditions. It further relates to novel surfactants.

Provided are compositions and methods useful in the post-CMP cleaning of microelectronic devices, in particular, devices which contain one or more surfaces comprising hydrophobic carbon or SiC. In general, the compositions comprise a chelating agent; a water-miscible solvent; a reducing agent; and a pH adjustor, wherein the composition has a pH of about 2 to about 13.