A composition comprises from 0.1 to 30 wt-% of one or more amino acids, 0.1 to 30 wt-% of one or more surfactants, and optionally one or more hydrotropes. The amino acids may be selected from arginine (ARG), lysine (LYS), histidine (HIS), glycine (GLY), or combinations thereof. The composition can be formulated as a cleaning composition, such as a hard surface cleaner, a floor cleaner, or a degreaser. The composition can be used in a method for treating a surface, where the composition is applied to the surface and allowed to remain on the surface for a length of time, and the surface is then wiped.

The present disclosure relates to a semiconductor device cleaning solution comprising a phenol compound at 10 ppb or less and having a ratio of a plasma generation number per pulsed laser irradiation number by a laser-induced breakdown detection method of less than 2%, and relates to a high-purity semiconductor device cleaning solution capable of suppressing the generation of residues on the cleaning target surface during cleaning of the semiconductor devices by effectively controlling phenol compounds that are inevitably generated in the semiconductor device cleaning solution preparation process and a method for preparing the same.