C11D3/14

CONSUMER PRODUCT COMPOSITIONS COMPRISING MICROCAPSULES
20190282467 · 2019-09-19 ·

A consumer product composition comprises a consumer product adjunct ingredient, a microcapsule, and nonionic terpolymer disposed on an outer surface of the microcapsule. The nonionic terpolymer has a viscosity of at least 0.8 poise and comprises monomers selected from the group consisting of acrylamide (AAM), dimethyl acrylamide (DMAA), dimethylamino propyl-acrylamide (DMAPA), dimethylamino propyl-methacrylamide (DMAPMA), N-alkyl acrylamide (AAA), N-octadecyl acrylamide (ODAA), and combinations thereof. The microcapsule comprises a shell material encapsulating a core material, wherein the shell material comprises a polyacrylate and the core material comprises a benefit agent.

CONSUMER PRODUCT COMPOSITIONS COMPRISING MICROCAPSULES
20190282466 · 2019-09-19 ·

A consumer product composition comprises a consumer product adjunct ingredient, a microcapsule, and cationic co-polymer disposed on an outer surface of the microcapsule. The cationic co-polymer has a viscosity of at least 0.09 poise and comprises monomers selected from the group consisting of acrylamide (AAM), dimethyl acrylamide (DMAA), acrylamidopropyl trimethylamonium chloride (APTAC), methacrylamidopropyl trimethylammonium chloride (MAPTAC), and combinations thereof. The microcapsule comprises a shell material encapsulating a core material, wherein the shell material comprises a polyacrylate and the core material comprises a benefit agent.

CONSUMER PRODUCT COMPOSITIONS COMPRISING MICROCAPSULES
20190282468 · 2019-09-19 ·

A consumer product composition comprises a consumer product adjunct ingredient, a microcapsule, and block co-polymer disposed on an outer surface of the microcapsule. The block co-polymer has a number average molecular weight of at least about 11 kilodaltons and comprises monomers selected from the group consisting of acrylamide (AAM), dimethyl acrylamide (DMAA), n-alkylacrylate (AA), and combinations thereof. The microcapsule comprises a shell material encapsulating a core material, wherein the shell material comprises a polyacrylate and the core material comprises a benefit agent.

Dishwashing pastes

Described herein, are dishwashing paste compositions comprising: an abrasive; a pH modifying agent in an amount effective to provide a pH greater than 7; a structuring agent; and a source of polyvalent cations. Methods of making and using these compositions are also described.

Dishwashing pastes

Described herein, are dishwashing paste compositions comprising: an abrasive; a pH modifying agent in an amount effective to provide a pH greater than 7; a structuring agent; and a source of polyvalent cations. Methods of making and using these compositions are also described.

Cleansing compositions

A personal care composition comprising a cosmetically acceptable base and inorganic particulate material, for example, a shower gel or hair shampoo, and a method of making the personal care composition. A cleaning composition comprising a base and inorganic particulate material, for example, a hard surface cleansing composition, and a method of making the cleaning composition. A composition, for example, a personal care composition, use of an inorganic particulate material having a d.sub.50 of from about 0.1 m to about 200 m in such a composition, and a method for making such a composition.

Cleansing compositions

A personal care composition comprising a cosmetically acceptable base and inorganic particulate material, for example, a shower gel or hair shampoo, and a method of making the personal care composition. A cleaning composition comprising a base and inorganic particulate material, for example, a hard surface cleansing composition, and a method of making the cleaning composition. A composition, for example, a personal care composition, use of an inorganic particulate material having a d.sub.50 of from about 0.1 m to about 200 m in such a composition, and a method for making such a composition.

Semiconductor treatment composition and treatment method

A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 310.sup.1 to 1.510.sup.3 per mL.

Semiconductor treatment composition and treatment method

A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 310.sup.1 to 1.510.sup.3 per mL.

Personal cleansing compositions comprising spherical perlite microspheres

A cleaning composition comprising a base and an inorganic particulate material selected from the group consisting of spherical perlite, alumina, vermiculite, nepheline and mixtures thereof, wherein the spherical perlite comprises microspheres that are substantially closed and hollow.