A single-step absorbent wipe for cleaning and disinfecting medical instruments includes various active ingredients as well as compounds that increase the efficacy profile of the product against various organisms, improve the buffering capacity of the formulation, enhance the antimicrobial efficacy against mycobacteria, increases the wetting and cleaning profile of the formulation, as well as adjusts the pH thereof. The disinfectant wipe provides a procedure to suitably clean and intermediate level disinfect medical instruments that are heat liable as well as non-submersible.

Pre-moistened wipes that include one or more characteristics correlated to desired properties, such as high durability, mileage, cleaning composition retention, efficacy, or the like are described. Pulp substrates typically include an anionic charge, which can result in binding or retention of a cationic biocide such as a quaternary ammonium compound while the remainder of the composition is released from the wipe (e.g., through squeezing, wiping or other compression). The present wipes are specifically tailored to release at least 20% of the quaternary ammonium compound to a target surface, and exhibit at least a 3-log reduction in Staphylococcus aureus population within about 10 seconds to 5 minutes. Such release and efficacy is achieved without the presence of any cationic biocide release agent (e.g., latex or a cationic salt) included in the cleaning composition or elsewhere within the pre-loaded disinfecting wipe.

Solid rinse aid compositions, methods of use, and methods of making said composition are disclosed. Rinse aid is provided by a solidification agent, a sheeting agent, a defoamer component, and a polyacrylic acid homopolymer or alkali metal salt thereof forming a solid compositions. Preferred solidification agents include aromatic sulfonates. Preferred sheeting agents include one or more alcohol ethyoxylates. Preferred defoamer components include a polymer compound including one or more ethylene oxide groups. The solid rinse aid compositions are preferably substantially free of sulfate and sulfate-containing compounds.

In one embodiment, a water in oil cleaning composition is disclosed that may include at least one solvent, in an amount of from about 1-90% (w/w) of the composition, at least one surfactant in an amount of from about 0.1-20% (w/w) of the composition, 3M KOH/de-ionized water, in an amount of from about 1-4% (w/w of the composition, rheological agents, in an amount of from about 0.1-8% (w/w) of the composition, and emulsifiers, in an amount of from about 0.5-20% (w/w) of the composition. Optionally, the composition may include antimicrobials in an effective amount, and may be present in an amount of from about 1-4% (w/w) of the composition, fragrants and colorants as desired.

A laundry scent additive having polyethylene glycol and perfume. The laundry scent additive enables consumers to control the amount of scent imparted to their laundry.

The invention provides a method for preparing a plurality of granules comprising a biological active and a non-volatile liquid by using mixer-granulation, wherein the granules exhibit reduced dust release upon exposure to mechanical stress.

A cleaner useful in removing undesirable polymeric material deposits adhered within small bore holes of electronic components is provided, as well as apparatus and methods for carrying out cleaning of such components.

Cleaning compositions that include a nuclease enzyme and one or more malodor reduction materials. Methods of making and using such cleaning compositions. Use of malodor reduction materials.

The present invention is a solid rinse aid composition and methods of making and using the same. Applicants have surprisingly found that the crystal modifier sodium xylene sulfonate (short chain alkyl benzene or alkyl naphthalene sulfonates) at higher percentage can act as a solidification agent. The solid rinse aid composition generally includes a short chain alkyl benzene or alkyl naphthalene sulfonates solidification agent and an effective amount of a surfactant which can include a sheeting agent component, defoamer component and/or association disruption agent. The solid rinse aid composition may be phosphate-free, aminocarboxylate-free, and GRAS if desired.

There is provided a cleaning fluid that effectively removes metal impurities and the like existing on a portion through which a chemical solution for lithography passes, before causing the chemical solution to pass through a semiconductor manufacturing equipment in a lithography process, in order to prevent defects caused by the metal impurities and the like found on a semiconductor substrate after forming a resist pattern or after processing a semiconductor substrate in a process for manufacturing semiconductor device. A cleaning fluid to clean a portion through which a chemical solution for lithography passes in a semiconductor manufacturing equipment used in a lithography process for manufacturing semiconductors, including: an inorganic acid; water; and a hydrophilic organic solvent. In the cleaning fluid, the concentration of the inorganic acid is preferably 0.0001% by mass to 60% by mass based on a total mass of the cleaning fluid.