The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.

The alpha alkylation of an aldehyde with a polycyclic olefin followed by a ring opening step is presented in order to provide a compound of formula (I) in the form of any one of its stereoisomers or a mixture thereof and where in R represents a hydrogen atom or C.sub.1-8 linear alkyl group; R.sup.1, R.sup.2, R.sup.3, and R.sup.4 represent, when taken separately, independently of each other, a hydrogen atom or a C.sub.1-2 linear alkyl group or a C.sub.3-4 linear or branched alkyl group; or R.sup.2 and R.sup.3, when taken together, represent a C.sub.4-10 linear, branched or cyclic alkanediyl group and n is 1 or 2 is presented.

##STR00001##

The present invention relates to a cleaning agent composition having an excellent cleaning power against a hard surface to which a polymer is adhered even under a room temperature condition, and provides [1] a cleaning agent composition containing a water-soluble organic amine (a), an alkylamine oxide (b) represented by the following general formula (1), an organic solvent (c) having a Hansen solubility parameter (HSP value) of 15 to 19.5 as measured at 20° C., and water; and [2] a method of cleaning a heard surface, including the step of cleaning the hard surface using the aforementioned cleaning agent composition at a temperature of not lower than 45° C. and not higher than 85° C.;

(R.sup.1)(R.sup.2)(R.sup.3)N.fwdarw.O   (1)

wherein R.sup.1 and R.sup.2 are each independently an alkyl group or alkenyl group having 1 to 3 carbon atoms, and R.sup.3 is an alkyl group or alkenyl group having 8 to 16 carbon atoms.

Described herein is a method of using as perfuming ingredients, e.g. to impart odor notes of the fruity, fruity-exotic types, cyclopentanone compounds of formula ##STR00001##
in a form of any one of its stereoisomers or a mixture thereof, and wherein n represents 1 or 2.

To provide a substrate pattern filling composition capable of suppressing pattern collapse and a method for using the same. A substrate pattern filling composition comprising a first solute (A), a second a solute (B) and a solvent (C), and a method for using the same.

Compositions that include at least one low molecular weight to oxygen containing solvent and one or more compounds of formula (I) wherein R is a C.sub.1-C.sub.6 alkyl; X is a C.sub.1-C.sub.10 alkyl and n is an integer from 0 to 5. Methods of removing polymeric material containing heteroatoms from a surface by contacting the surface with such compositions and wiping the composition at least some portion of the polymeric material from the surface.

##STR00001##

A cleaning liquid usable for cleaning a substrate provided with a metal resist, the cleaning liquid including a solvent, an organic acid, and a compound (A) represented by general formula (a-1) shown below (in the formula, Ra.sup.1 and Ra.sup.2 each independently represents an alkyl group having 1 to 3 carbon atoms).

##STR00001##

The regio-selective functionalization of a dialkyl benzene compound ##STR00001##
wherein the ratio of the compound functionalized at position (a) to the compound functionalized at the position (b) is at least 70:30, more particularly at least 80:20, still more particularly at least 85:15, and still more particularly at least 90:10, characterised in that the substituent R is an isobutyl group.

The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.

Disclosed are methods for using a composition comprising HCl, urea, complex substituted keto-amine-hydrochloride, at least one alcohol selected from the group consisting of isopropyl alcohol and propargyl alcohol, an ethoxylate, and at least one ketone selected from the group consisting of methyl vinyl ketone, acetone, and acetophenone.