The present invention provides: a cleaning liquid for semiconductor substrates having undergone CMP, the cleaning liquid being excellent in temporal stability and cleaning performance; and a method of cleaning such semiconductor substrates. A cleaning liquid of the invention contains: a first amine compound which is represented by Formula (1) and whose conjugated acid has a first acidity constant of not less than 8.5; and a second amine compound (provided that the first amine compound is excluded). The mass ratio of the first amine compound content to the second amine compound content is 1 to 100, and the cleaning liquid has pH of 6.0-12.0 at 25° C.

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Novel methods and compositions for treating textiles and other materials are disclosed in which persistent odor or other symptoms of biofilm presence can be reduced through the use of compositions comprising N-acetyl cysteine or other agents in combination with certain enzymes.

Polishing compositions are disclosed for simultaneously removing particles from a surface that has been polished using a CMP slurry comprising a polishing rate accelerator and removing a pad stain from a polishing pad that has been contacted with a CMP slurry comprising a polishing rate accelerator.

Cleaning compositions for post-CMP cleaning of semiconductor surfaces, comprise one or more reducing agents, a particle removal agent, a surfactant, and a base. When one or more reducing agents yields a standard reduction potential of less than 1.224 V, the cleaning composition of the present disclosure is able to remove a MnO.sub.2 pad stain from a polishing pad and reduce defects on a polished surface (by removing particles).

Cleaning compositions that include a nuclease enzyme and one or more malodor reduction materials. Methods of making and using such cleaning compositions. Use of malodor reduction materials.

There is provided a cleaning fluid that effectively removes metal impurities and the like existing on a portion through which a chemical solution for lithography passes, before causing the chemical solution to pass through a semiconductor manufacturing equipment in a lithography process, in order to prevent defects caused by the metal impurities and the like found on a semiconductor substrate after forming a resist pattern or after processing a semiconductor substrate in a process for manufacturing semiconductor device. A cleaning fluid to clean a portion through which a chemical solution for lithography passes in a semiconductor manufacturing equipment used in a lithography process for manufacturing semiconductors, including: an inorganic acid; water; and a hydrophilic organic solvent. In the cleaning fluid, the concentration of the inorganic acid is preferably 0.0001% by mass to 60% by mass based on a total mass of the cleaning fluid.

The present application relates to perfume raw materials, perfume delivery systems and consumer products comprising such perfume raw materials and/or such perfume delivery systems, as well as processes for making and using such perfume raw materials, perfume delivery systems and consumer products. Such perfume raw materials and compositions, including the delivery systems, disclosed herein expand the perfume communities' options as such perfume raw materials can provide variations on character and such compositions can provide desired odor profiles.

A detergent composition includes a surfactant component present in an amount of from about 5 to about 70 weight percent actives based on a total weight of the composition, water present in an amount of from about 5 to about 90 weight percent based on a total weight of the composition, polyvinyl alcohol particles present in an amount of from about 0.1 to about 5 weight percent based on a total weight of the composition, and a functional material that is encapsulated in the polyvinyl alcohol particles and is chosen from enzymes, surfactants, functional polymers, and combinations thereof and present in an amount of from about 0.05 to about 2 weight percent actives based on a total weight of the composition.

The invention provides an aqueous solution capable of selectively protecting a nitrogen-containing silicon compound from corrosion by a treating solution for etching, cleaning or the like, etching oxygen-containing, carbon-containing silicon in particular, and making a large etch rate difference between a nitrogen-containing silicon compound and an oxygen-containing silicon compound, and a process for producing electronic parts as well. The invention is embodied by a treating solution for electronic parts that is an aqueous solution containing one or two or more of anionic surface active agents represented by the following formulae (1), (2) and (3), and a process for producing an electronic part. ##STR00001## wherein R.sub.1, R.sub.2, and R.sub.3 stands for hydrogen or an alkyl or alkylene group having 1 to 4 carbon atoms, and X.sub.1 stands for a functional group capable of becoming an anionic ion. ##STR00002## wherein R.sub.4 stands for hydrogen or an alkyl or alkylene group having 1 to 4 carbon atoms, X.sub.2 stands for a functional group capable of becoming an anionic ion, and n stands for a natural number of greater than 2. ##STR00003## wherein R.sub.5 stands for hydrogen or an alkyl or alkylene group having 1 to 4 carbon atoms, and X.sub.3, and X.sub.4 stands for a functional group capable of becoming an anionic ion.

Described are compositions and methods for the removal of zinc-oxide eugenol-based temporary cements or root canal filling materials from a variety of surfaces including surfaces inside the oral cavity, such as teeth, as well as surfaces of objects located outside of the oral cavity, such as instruments and prostheses. In certain compositions, the resin-dentin bond between permanent cements and collagen-containing surfaces can be increased. The compositions are non-toxic, can be used inside the oral cavity, and do not require special disposal procedures.

A viscoelastic, solid surfactant composition, containing, (i) a total amount of 0.1 to 70 wt % of at least one surfactant, (ii) a total amount of more than 1 wt % of at least one benzylidene alditol compound of formula (I), and (iii) water, is a readily soluble, aesthetically pleasing and storage-stable form of a solid composition for providing surfactant-containing liquors.