Disclosed are the use of fluorine substituted olefins, including tetra- and penta-fluoropropenes, in a variety of applications, including in methods of depositing catalyst on a solid support, methods of sterilizing articles, cleaning methods and compositions, methods of applying medicaments, fire extinguishing/suppression compositions and methods, flavor formulations, fragrance formulations and inflating agents.

Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.

Disclosed are the use of fluorine substituted olefins, including tetra- and penta-fluoropropenes, in a variety of applications, including in methods of depositing catalyst on a solid support, methods of sterilizing articles, cleaning methods and compositions, methods of applying medicaments, fire extinguishing/suppression compositions and methods, flavor formulations, fragrance formulations and inflating agents.

Provided is a cleaning solution used for cleaning an ink containing a resin in an amount of 5 percent by mass or greater, the cleaning solution including a mixture solvent containing water and a solvent, wherein a hydrogen bond term of a Hansen solubility parameter of the mixture solvent is 7.0 (cal/cm.sup.3).sup.1/2 or less.

A pre-fill solution for application onto a substrate surface prior to a fill operation is provided, the fill operation defined by application of an electroless deposition solution onto the substrate surface to deposit a metallic material in an etched feature, the substrate surface having metallic contaminants generated from an etch operation that generated the etched feature in the substrate surface, the pre-fill solution effective for preventing the electroless deposition solution from depositing on the metallic contaminants, the pre-fill solution comprising: a surfactant, the surfactant configured to enhance wetting of the substrate surface, the concentration of the surfactant in the solution being approximately in the range of 10 ppm to 2000 ppm, wherein the surfactant is an amphoteric surfactant; oxalic acid dihydrate; and hypophosphorous acid as a pH adjusting agent configured to reduce the pH of the solution to approximately less than 2 during the application onto the substrate surface.

A composition includes a compound having structural formula (I): RfSRh (I) wherein (i) Rf is a partially fluorinated or perfluorinated group having 2 to 6 carbon atoms and optionally comprises one or more catenated heteroatoms, and (ii) Rh is a non-fluorinated hydrocarbon group having 1-3 carbon atoms and optionally comprises one or more catenated heteroatoms. The composition further includes an organic lubricant contaminant.

A solvent composition is provided that includes a chlorinated ethylene present from 75 to 80 total weight percent and at least one halocarbon miscible with the chlorinated ethylene and present in an amount to define a weight ratio of the chlorinated ethylene to said at least one halocarbon of from 75:25-80:20. The solvent composition has a flash point of less than 23 degrees Celsius and an initial boiling point of greater than 35 degrees Celsius. When the solvent is packaged as an aerosol with a propellant, the resulting solvent can be used in confined spaces owing to reduced ignitibility and better human health and environmental properties compared to conventional aerosol degreasers.

The present invention relates, in part, to cleaning methods and solvent cleaning compositions including at least one hydrofluoro-olefin or hydrochlorofluoro-olefin solvent for use in connection with cleaning of metal parts, and in certain preferred embodiments cleaning metal parts to be used in an aircraft.

The present invention is a deep cleaning process for carpets through its unique restorative cleaning process. The present comprises a use of restorative cleaning agent and cleansers according to the pH level of the stain, and a method either of agitating with hand-held polyester carpet brush or of rotary power scrubbing with polyester brush.

Through its unique deep cleaning process including anti-ghost stain treatment to prevent the stain from re-appearing, the present invention will yield cleaner cleaning process than the industry standard cleaning method. In an alternative embodiment of the Restorative Cleaning Process of the present invention, man-made carpet fibers are cleaned using a series of cleaning steps designed to extract soil particulates from the fibers of the carpet and decrease the time it takes for the carpet to dry. In addition, an anti-reappearing ghost spot device utilizing the anti-reappearing ghost spot post-treatment is used to prevent spots from re-appearing.

Disclosed is a composition for removing polymers. The composition contains a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound.