A composition comprising: at least 25% of a fatty acid methyl ester having from 6 to 14 carbon atoms, or a mixture of such methyl esters; at least 15% of dimethyl sulfoxide, or DMSO; and at least 5% of a glyceryl fatty acid monoester having from 6 to 14 carbon atoms or a mixture of such glyceryl monoesters; the percentages being percentages by weight relative to the total weight of the composition. This composition is stable at low temperature and may be used as a cleaning, dissolvent, dispersant and/or diluent composition, especially for active principles in the plant protections field.

Methods for using sulfur-containing compounds comprising short chain aliphatic ester or amide moieties as solvents and compositions comprising these compounds are provided.

A disinfectant material may be used to kill bacteria, viruses, mold and fungal contaminants while minimizing toxic risks to humans. The disinfectant material may be effective in killing pathogens and more on numerous types of surfaces including on the skin of mammals. Exemplary embodiments include a copper halogen, such as copper iodide. Exemplary materials may also include a pH stabilizer, a preservative, humectants, or other constituents. Exemplary disinfectant materials may be used as a liquid or a gel, applied via a wipe, sprayed or in other forms.

Compositions, process mixtures, methods, and kits are provided for removing one or more coatings from a polymeric substrate, e.g., corrugated polymeric substrates, using a single-phase aqueous solution. The single-phase aqueous solution may include, for example, water; an inorganic base composition; a sulfoxylate composition; and a surfactant composition.

Provided is a composition that contains a compound a) and at least one chemical entity b) dissolved in compound a). Compound a) has at least one sulfoxide functional group and/or one sulfone functional group, and at least one amide functional group. The composition is useful for a variety of applications, including manufacturing a film, a coating on a support, a hollow fiber, an artificial leather, a polymeric fiber, a membrane, a separator or an electrode for batteries, an electronic circuit or a sheath for the protection of electric cables.

A cleaning composition includes a surfactant, deionized (DI) water, and an organic solvent. The surfactant has a concentration of from about 0.03 M to about 0.003 M. A cleaning apparatus includes a chuck that receives a substrate, a nozzle for providing the cleaning composition onto the substrate. The cleaning apparatus further includes a chemical solution supply unit supplying the cleaning composition to the nozzle. The chemical solution supply unit mixes the cleaning composition to generate cleaning particles. The cleaning composition includes a surfactant, deionized (DI) water, and an organic solvent. The surfactant has a concentration of from about 0.03 M to about 0.003 M. A method for manufacturing a semiconductor device includes processing a substrate, forming an interlayer insulating layer, polishing an interlayer insulating layer, and providing a cleaning composition onto the interlayer insulating layer to remove first particles.

A composition includes a first solvent selected from methyl acetate, dimethyl carbonate, acetone, or a combination thereof, a second solvent selected from thiophene, 1,3-dioxolane, thioacetic acid, or a combination thereof, and, optionally, a third solvent selected from dimethyl sulfoxide, methyl glyoxal, propylene carbonate, gamma butyrolactone, ethylene carbonate, 2-chloro-1-propanol, methanol, ethanol, ethylene glycol, propylene glycol, 1-propanol, 2-propanol, or a combination thereof. The respective amounts of each solvent are further described herein, and the total amounts of the first solvent, the second solvent, and the third solvent sum to at least 90 volume percent of the total volume of the composition. The composition can be particularly useful for removal of a coating from a surface. Accordingly, a method of removing a coating from a surface is also disclosed.

A method of cleaning highway and road construction equipment is disclosed.

Provided is a decomposing/cleaning composition for an adhesive polymer having a high etching rate and suppressed infiltration into a contact interface between a substrate such as a device wafer and an adhesive layer such as a fixing tape. The decomposing/cleaning composition of one embodiment is a decomposing/cleaning composition for an adhesive polymer containing a quaternary alkylammonium fluoride or a quaternary alkylammonium fluoride hydrate and an aprotic solvent, wherein the aprotic solvent contains (A) an N-substituted amide compound having no active hydrogens on the nitrogen atoms and (B) at least one organic sulfur oxide selected from the group consisting of sulfoxide compounds and sulfone compounds.

Methods for using sulfur-containing compounds comprising short chain aliphatic ester or amide moieties as solvents and compositions comprising these compounds are provided.