The disclosure generally relates to a composition and process for cleaning residue and/or contaminants from microelectronic devices having said residue and contaminants thereon. The residue may include post-CMP, post-etch, and/or post-ash residue. The compositions and methods are particularly advantageous when cleaning a microelectronic surface comprising copper, low-k dielectric materials, and barrier materials comprising at least one of tantalum-containing material, cobalt-containing material, tantalum-containing, tungsten-containing, and ruthenium-containing material.

A dissolvable sheet having a water-soluble substrate, and one or more cleaning actives disposed uniformly throughout the water-soluble substrate. The water-soluble substrate is formed from a first substrate builder comprising polyvinyl alcohol, a second substrate builder, such as starch, and sodium laurylglucosides hydroxypropylsulfonate, and is sized and shaped to form a sheet, and hold a premeasured amount of the cleaning active. The substrate dissolves when contacted with a sufficient amount of water, thereby releasing the cleaning active into the water, which also dissolves in the water. A method of making the dissolvable sheet is also disclosed.

The present invention relates to a composition consisting essentially of a sulfonic acid component selected from the group consisting of camphor sulfonic acid, and a benzene sulfonic acid of structure (I), wherein R is H or a C-1 to C-18 n-alkyl, oxalic acid, a solvent component which consists essentially of an organic solvent component, or a mixture of an organic solvent components and water, wherein the organic solvent component consist of about 100 wt % to about 85 wt % of said solvent component, and further wherein said organic solvent component is either selected from solvent (III), (IV), (V), (VI) (wherein R is selected from the group consisting of —(-0-CH.sub.2—CH.sub.2—).sub.n′—OH, —OH, and -0-C(═O)—CH.sub.3, wherein n′ is equal to 1, 2, 3, or 4), (VII) (wherein Ra is H or a C-1 to C-4 alkyl moiety), (VIII), (IX) (wherein Rb is a C-1 to C-18 alkyl moiety), (X), and (XI) or is a mixture, of at least two organic solvents selected from this group. The invention also relates to such compositions also containing a surfactant component, and also pertains to the process of using either of these compositions as a resist remover.

##STR00001##

Dipropylene glycol monomethyl ether (III),

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The disclosure generally relates to a composition and process for cleaning residue and/or contaminants from microelectronic devices having said residue and contaminants thereon. The residue may include post-CMP, post-etch, and/or post-ash residue. The compositions and methods are particularly advantageous when cleaning a microelectronic surface comprising copper, low-k dielectric materials, and barrier materials comprising at least one of tantalum-containing material, cobalt-containing material, tantalum-containing, tungsten-containing, and ruthenium-containing material.

Cleaning solution for cleaning and/or wetting metal surfaces, comprising at least one acid, a first surfactant, which is an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of 25 C., a second surfactant, which is selected from the group consisting of i) an alkyl-poly(ethyleneglycol-co-propyleneglycol)-ether having a cloud point of 30 C., ii) an alkyl-polyethyleneglycol-ether having a cloud point of 45 C.
wherein the cloud points are determined according to European Standard EN 1890:2006, item 8.2 of German Version, with the modification that 10 wt % H.sub.2SO.sub.4 is used as solvent and that the concentration of the surfactant is 1000 mg/L.

Fabric treatment compositions that include benefit agent capsules and biphenyl brightener. Methods of using the same. Wash water that includes such compositions.

Fabric treatment compositions that include benefit agent capsules and biphenyl brightener. Methods of using the same. Wash water that includes such compositions.

A treatment liquid is a treatment liquid for a semiconductor device, which contains a fluorine-containing compound and a water-soluble aromatic compound not having a heterocyclic group but having a benzene ring, and has a pH of 5 or less.

The present invention discloses a method of imparting water repellency and optionally stain release to fibrous substrates by contacting a fibrous substrate with a non-fluorinated laundry treatment composition inside a laundry machine. The laundry treatment composition contains a hydrophobic organic urethane compound having a urethane linkage and the residue of a substituted cyclic or acyclic sugar alcohol. Laundry additive compositions containing a first laundry treatment composition, having a hydrophobic organic urethane compound, and a second laundry treatment composition are also included.

Disclosed herein are a process of manufacturing ether sulfates based on isomeric tridecyl alcohol mixtures and ether sulfates based on isomeric tridecyl alcohol mixtures obtained or obtainable by such a process. Further disclosed herein are a composition including the ether sulfates based on isomeric tridecyl alcohol mixtures and a method of using the ether sulfates.