Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process, etc in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic rind are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.

A polymer comprising a first fraction and a second fraction, wherein the first fraction comprises from 90 to 100 wt % polymerized C.sub.3-C.sub.6 carboxylic acid monomer units; and the second fraction comprises from 30 to 80 wt % polymerized C.sub.3-C.sub.6 carboxylic acid monomer units and from 20 to 70 wt % polymerized sulfonic acid monomer units; wherein the first fraction is from 10 to 40 wt % of the polymer and the second fraction is from 60 to 90 wt % of the polymer; the polymer has M.sub.w from 3,000 to 30,000; and monomers are randomly distributed within each fraction.

A disinfectant concentrate devoid of phosphoric acid and method of using the concentrate. The concentration including a mixture containing: a) a major amount of hydrogen peroxide, b) a beta hydroxy acid, c) a minor amount of hydroxyalkane diphosphonic acid, one or more of a solvent and/or surfactant, and the balance water.

An automatic dishwashing cleaning composition and method of use is described. The automatic dishwashing cleaning composition can include a terpolymer including (meth)acrylic acid, linear or branched C1-C20 alkyl (meth)acrylate and vinylpyrrolidone; and a non-ionic surfactant.

A composition for cleaning a microelectronic device substrate is provided. The composition is useful for cleaning in-process microelectronic device substrates possessing exposed cobalt, molybdenum, copper, molybdenum, tungsten, and dielectric surfaces. Also provided is a method for cleaning such devices and a kit comprising one or more of the components of the composition.

The present technology generally relates to liquid compositions for cleaning post-CMP semiconductor surfaces, and methods of cleaning a semiconductor surface having ceria (CeO.sub.2) particles thereon.

The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.

An automatic dishwashing composition is provided including a builder; a phosphonate; a nonionic surfactant; and a dispersant polymer, comprising: structural units of formula I

##STR00001##

wherein each R.sup.1 is independently selected from a hydrogen and a —C(O)CH.sub.3 group; and structural units of formula II

##STR00002##

wherein each R.sup.2 is independently selected from a hydrogen and a —CH.sub.3 group; and wherein the automatic dishwashing composition contains ≤0.1 wt % of dispersant polymer having a lactone end group and wherein the dispersant polymer has a weight average molecular weight of 1,500 to 10,000 Daltons.

A plastic cleaning method for cleaning a plastic article in an automatic dishwashing machine is provided, comprising: selecting an automatic dishwashing composition for cleaning plastic, wherein the automatic dishwashing composition, comprises: a builder; a phosphonate a nonionic surfactant; and a dispersant polymer comprising: (a) 60 to 98 wt % of structural units of formula I

##STR00001## wherein each R.sup.1 is independently selected from a hydrogen and a —CH.sub.3 group; and (b) 2 to 40 wt % of structural units of formula II

##STR00002## wherein each R.sup.2 is independently selected from an alkyl group with at least 4 carbon atoms and wherein each R.sup.3 is independently selected from a hydrogen and a methyl group.

Stabilized compositions employing a sequestrant system and a binding system for improving shelf stability and dispensing stability of a solid activated bleach composition are disclosed. The compositions contain a peroxygen source and a catalyst activator which require generation of a peroxycarboxylic acid or other active oxygen sanitizing agent at a point of use. Stabilized compositions employ a sequestrant system including a phosphonic acid and/or dipicolinic acid sequestrant and a binding system comprising an anionic surfactant for a solid formulation of a catalyst activator and peroxygen source to provide shelf stability and dispensing stability for a activated bleach composition. Methods of formulating and use are further disclosed.