A solid hard surface cleaning composition suitable for replacing liquid formulations while providing at least equivalent or enhanced cleaning performance, including at lower concentrations, is provided. The solid hard surface cleaning compositions include alkali metal carbonate alkalinity source(s), aminocarboxylic acid chelant(s), amphoteric surfactant(s), polyacrylate polymer(s) and anionic surfactant(s). The solid hard surface cleaning compositions can include additional functional ingredients, such as corrosion inhibitors. The solid hard surface cleaning compositions do not include hydroxide alkalinity and beneficially provide stable ready-to-use formulations that are safe for contact without the use of personal protective equipment (PPE) and are compatible with soft metals.

Improved liquid detergent concentrate compositions which are phosphorus free and utilize an acrylic copolymer to provide improved stability while maintaining viscosity are provided. Methods of using the same to wash textiles are also provided. The improved liquid detergent composition may be provided in the form of the concentrated emulsion or a use solution; and where the concentrated emulsion can be a water-in-oil emulsion or oil-in-water emulsion dependent on the amounts of water and oil in the emulsion.

The present invention relates to a method for treating fabrics by using an automatic laundry washing machine, in which unwetted fabrics are contacted with water that has been automatically pre-treated with a pre-treatment composition comprising at least one chelant before the wash cycle starts.

The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.

A high foaming liquid alkaline cleaner comprises one or more alkalinity sources; one or more surfactants comprising a hydrotrope, one or more wetting and soil emulsifying surfactants, one or more foam volume generating surfactants, and one or more foam boosting surfactants and one or more sequestrants. Optionally, an organic solvent can be utilized. The high foaming liquid alkaline cleaning composition is generally prepared in a concentrated form and can be diluted as with water. The alkaline cleaner provides effective cleaning properties, with respect to fats, oils, and organic soils.

A detergent composition including an oleic acid-transforming enzyme and a surfactant system. Furthermore, a method of manually washing articles including the steps of: delivering a composition including an oleic acid-transforming enzyme and a surfactant system to a volume of water to form a wash liquor and immersing the soiled articles, in the liquor.

A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP by-product contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.

The present invention relates to a composition for cleaning surfaces and/or for detecting organic substances in a solution or on a surface, comprising a) at least one salt of the permanganic acid, ferric acid and/or chromic acid, b) at least one organic phosphonate and c) at least one persulphate,
wherein the at least one organic phosphonate has a general formula (I)

##STR00001##

wherein R.sup.1 is an organic moiety, X.sup.1 is OH or OM.sub.1 and X.sup.2 is OH or OM.sub.2, wherein M.sub.1 and M.sub.2 represent an alkali metal ion or ammonium ion, wherein the organic moiety R.sup.1 is a mono-substituted or multiple-substituted or unsubstituted C.sub.1-C.sub.12 alkyl moiety, C.sub.3-C.sub.10 cycloalkyl moiety or C.sub.6-C.sub.14 aryl moiety, wherein the organic moiety may be attached to 1 to 3 further phosphonate groups of the general formula (I).

The present invention relates to herbicidal compositions comprising an aminophosphate or aminophosphonate salt, particularly to herbicidal compositions comprising a relatively high amount of aminophosphate or aminophosphonate salt and a betaine-based surfactant composition of matter.

The invention provides a removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP by-product contaminant material from the surface of the microelectronic device.