A cleaning liquid for excessive powder removal is provided. The cleaning liquid includes a hydrocarbon solvent having an octanol/water partition coefficient (log P.sub.ow value) of 4.5 or more. The cleaning liquid is to remove excessive powder for molding adhering to a solidified object molded using the powder for molding.

A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4). ##STR00001##