A bevel portion treatment agent composition of the present invention is a bevel portion treatment agent composition containing a silylating agent, which is used for treating a bevel portion of a wafer, in which a surface modification index Y and a surface modification index Z measured by a predetermined procedure have a characteristic of satisfying 0.5≤Y/Z≤1.0.

Provided is a high-purity isopropyl alcohol in which the concentration of a C7-12 acetal compound is 100 ppb or less on a mass basis, the concentration of the acetal compound in an accelerated test involving heating for 4 hours at 80° C. in a nitrogen atmosphere is increased by a factor of 30 or less with respect to the value thereof prior to heating, and the concentration of the acetal compound is maintained at a value of 100 ppb or less on a mass basis. Also provided is a method for manufacturing said high-purity isopropyl alcohol.

The present invention provides a composition for solidification of human spit & vomit. The composition is having a sodium polyacrylate in 10 gram by weight, a food grade color, an aromatic compound in 5 by volume, an aromatic oil in 5 millilitre by volume, an antibacterial polymers in the range between 2 gram by weight, a polybio masterbatches in 2 gram by weight, acetic acid in 5 gram by weight, a sanitizer in 50 millilitre by volume. The composition has an advantage of preventing from germs. Also, the composition has an advantage of being tamper proof. This composition will be used in multiple Devices like—any type of Pouches, containers, Boxes, Cup, jars, mugs, bins, bottles etc.

The present invention relates to a remover composition comprising, tetraalkylammonium hydroxide, a benzylic alcohol, a glycol component comprising at least one glycol compound, and a and an alkyl amine component, wherein said alkyl amine component is selected from the group consisting of a dialkyl amine, a mono-alkyl amine having structure having structure (I), and combinations thereof wherein, in said di-alkyl amine, one of the alkyl groups is a C-1 to C-4 n-alkyl and the other alkyl group is a C-16 to C-20 n-alkyl, and for said mono-alkyl amine m′ and m are independently chosen from an integer ranging from 4 to 8. This invention also pertains to the process of using these compositions to remove a patterned photoresist from a substrate. ##STR00001##

A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

Described are methods for removing abrasive particles from a polymeric surface, such as from a polymeric surface of a cleaning brush used in a post chemical-mechanical processing cleaning step, as well as related cleaning solutions.

A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

A bevel portion treatment agent composition of the present invention is a bevel portion treatment agent composition containing a silylating agent, which is used for treating a bevel portion of a wafer, in which a surface modification index Y and a surface modification index Z measured by a predetermined procedure have a characteristic of satisfying 0.5≤Y/Z≤1.0.

The present invention provides a composition for a semiconductor device, which is excellent in residue removability. In addition, the present invention provides a substrate washing method using the treatment liquid. The composition for a semiconductor device contains alcohol, an aprotic polar solvent, an azole compound, an alkanolamine, and water.

The invention relates to a non-corrosive process for cleaning a recyclable material comprising the following steps: (a) providing a contaminated recyclable material; (b) treating the contaminated recyclable material at a temperature in the range of from 45-30° C. with a solution that contains one or more polyols to remove contaminants from the contaminated recyclable material, wherein the one or more polyols is (are) present in an amount of at least 15 wt. %, based on the total weight of the solution, thereby forming a liquid 10 mixture which comprises one or more polyols, contaminants removed from the recyclable material, and treated recyclable material; (c) separating at a temperature in the range 10-55° C. at least part of the recyclable material as obtained in step (b) from the liquid mixture as obtained in step (b); (d) allowing at least part of the remaining liquid mixture as obtained in step (c) to phase-1 separate into a polyol phase and a phase which contains contaminants removed from the contaminated recyclable material; (e) recovering the polyol phase as obtained in step (d); (f) recovering the phase which contains contaminants removed from the recyclable material as obtained in step (d); and 20 (g) recovering the separated recyclable material as obtained in step (c).