The present invention provides a composition that suppresses the occurrence of defects in an object to be applied, even in a case of being used after a predetermined period of time has elapsed from the production. In addition, the present invention provides a manufacturing method for a semiconductor element and a cleaning method for a semiconductor substrate.

The composition according to the present invention is a composition containing an antibacterial agent, an organic acid, an organic amine, and water, in which a content of the water is 70% by mass or more with respect to a total mass of the composition, and a pH at 25 C. is 4.0 to 9.0.

A composition including (a) a quaternary ammonium hydroxide having a general formula (I): ##STR00001##
as defined herein, and (b) a dipolar aprotic solvent substantially free of water.

A method and cleaning composition for microelectronic devices or semiconductor substrates including at least one alkanolamine; at least one hydroxylamine or derivatives of hydroxylamine or mixtures thereof; at least one polyfunctional organic acid with at least two carboxylic acid groups and water. The cleaning compositions can further include at least one corrosion inhibitor.

The invention provides a composition comprising water, a chelating agent, and a pH adjustor. The invention also provides a method for removing residue from a surface of a microelectronic device substrate comprising contacting the surface of the microelectronic device substrate with a composition comprising water, a chelating agent, and a pH adjustor.

A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10.sup.12 to 10.sup.4.