Patent classifications
C11D7/3245
Cleaning Fluid, Method of Cleaning Semiconductor Wafer, and Method of Preparing Semiconductor Wafer
The present invention relates to a cleaning fluid containing components (A) to (C) and 0.001 mass % or less of a surfactant, in which component (A) is a compound represented by formula (1); component (B) is an alkaline compound; and component (C) is water,
##STR00001## in formula (1), R.sub.1 and R.sub.2 independently represent a hydroxyl group or a phenol group.
METHODS FOR REFURBISHING AEROSPACE COMPONENTS
Embodiments of the present disclosure generally relate to methods for refurbishing aerospace components by removing corrosion and depositing protective coatings. In one or more embodiments, a method of refurbishing an aerospace component includes exposing the aerospace component containing corrosion to an aqueous cleaning solution. The aerospace component contains a nickel superalloy, an aluminide layer disposed on the nickel superalloy, and an aluminum oxide layer disposed on the aluminide layer. The method includes removing the corrosion from a portion of the aluminum oxide layer with the aqueous cleaning solution to reveal the aluminum oxide layer, then exposing the aluminum oxide layer to a post-rinse, and forming a protective coating on the aluminum oxide layer.
Synthetic Acid and Associated Methods
Glycine is an organic compound that can be used in the making of a synthetic acid that obviates all the drawbacks of strong acids such as hydrochloric acid. The new compound is made by dissolving glycine in water, in a weight ratio of approximately 1:1 to 1:1.5. The solution is mixed until the glycine is essentially fully dissolved in the water. Once dissolution is complete, hydrogen chloride gas is dissolved in the solution to produce the new compound, which can be referred to as hydrogen glycine. Also disclosed is a method for adjusting the pH of a fluid, the method comprising adding an effective amount of a solution to the fluid for adjusting the pH thereof to a desired level, wherein the solution is prepared by mixing glycine in water to form a glycine solution; and adding hydrogen chloride to the glycine solution.
Process for treating a fabric and related compositions
Laundry additive compositions that include a metal sequestration agent and that may be characterized by an acidic pH. Related methods of treating a fabric, for example with a wash liquor and a rinse liquor, with such compositions and/or agents. Uses of such laundry additive compositions.
Cleaning formulation for removing residues on surfaces
This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
PROCESS FOR MAKING A GRANULE
Process for making a powder or granule containing (A) at least one chelating agent selected from alkali metal salts of methyl glycine diacetic acid (MGDA) and of iminodisuccinic acid (IDS), (B) at least one compound of general formula (I a) or (I b)
##STR00001## wherein A.sup.1 is selected from (CH.sub.2).sub.a wherein the variable a is in the range of from 4 to 20, e is selected from zero and 1, and R.sup.1 being the same or different and selected from O—C.sub.1-C.sub.10-alkyl and C.sub.1-C.sub.10-alkyl, and, optionally, (C) at least one homo- or copolymer of (meth)acrylic acid, partially or fully neutralized with alkali, said process comprising the steps of (a) providing an aqueous solution or slurry containing chelating agent (A) and said compound (B) and, if applicable, (co)polymer (C), with a pH value in the range of from 10 to 12, (b) removing most of said water by spray drying or spray granulation.
COMPOSITIONS AND METHODS FOR REDUCING INTERACTION BETWEEN ABRASIVE PARTICLES AND A CLEANING BRUSH
Described are methods for removing abrasive particles from a polymeric surface, such as from a polymeric surface of a cleaning brush used in a post chemical-mechanical processing cleaning step, as well as related cleaning solutions.
COMPOSITION AND SUBSTRATE WASHING METHOD
The present invention provides a composition for a semiconductor device, which is excellent in residue removability. In addition, the present invention provides a substrate washing method using the treatment liquid. The composition for a semiconductor device contains alcohol, an aprotic polar solvent, an azole compound, an alkanolamine, and water.
SUSTAINABLE LAUNDRY SOUR COMPOSITIONS WITH IRON CONTROL
Linen treatment compositions and linen processes are disclosed which help to prevent iron deposition from wash water, and/or redeposition after iron containing stain (such as blood) removal by alkaline detergents. The linen treatment composition is a combination of a hydroxycarboxylic acid and an acid source, which may be organic or inorganic. The invention provides for effective iron control in a phosphorus-free formula that is also free of toxic or hazardous chemicals and includes sustainable, environmentally friendly ingredients, while still providing effective iron control.