A novel class of compounds is described here. The disclosed novel compounds have one hydrophilic group and two identical hydrophilic ionic groups. The two hydrophilic groups of the disclosed compounds contain or end with a cationic or anionic charged group. The disclosed novel compounds herein can be used as surfactants in an article, product, or composition, or for some other purposes. A method to synthesize the disclosed novel compounds is also described.

A cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt and a composition solvent including a first organic solvent and a second organic solvent; the first organic solvent is an amide derivative represented by formula (Z) (wherein R.sup.0 represents an ethyl group, a propyl group, or an isopropyl group; and each of R.sup.A and R.sup.B represents a C1 to C4 alkyl group); the second organic solvent is a non-amide organic solvent other than the amide derivative; and the composition has a water content less than 4.0 mass %. ##STR00001##

A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

Disclosed herein are the methods of using di-cationic or di-anionic compounds, which are derived from primary amine through an aza-Michael addition with an activated olefin, in a corrosion control composition to mitigate corrosion of a surface in a water system. The disclosed methods or compositions are found to be more effective than those methods or compositions including commonly used single quaternary compounds for mitigating corrosion for a metal surface in water systems.

A detergent additive comprising an active, the active comprising one or both of tetraacetylethylenediamine and triacetylethylenediamine; and polyvinyl butyral. A method of preparing a detergent additive comprising providing a solvent to a reaction mixture; providing polyvinyl butyral to the reaction mixture; providing an active to the reaction mixture, the active comprising one or both of tetraacetylethylenediamine and triacetylethylenediamine; mixing the reaction mixture; and spray-drying the reaction mixture.

Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.

The present disclosure relates to a process solution composition for polymer treatment comprising: a fluorine compound; a ketone-based solvent; and a polar aprotic solvent, wherein the ketone-based solvent is one or more selected from the group consisting of compounds represented by Chemical Formula 1 or Chemical Formula 2, and has an effect capable of preventing damage to various types of metals while improving the power of removing an adhesive polymer remaining on the wafer circuit surface in a semiconductor manufacturing process.

A detergent additive comprising an active, the active comprising one or both of tetraacetylethylenediamine or triacetylethylenediamine; and a copolymer having maleic anhydride-based repeat units and either or both of olefinic or styrenic-based repeat units; and wherein at least a portion of the maleic anhydride-based repeat units are neutralized.

Compositions and methods useful for removing residue and photoresist from a semiconductor substrate comprising: from about 5 to about 60% by wt. of water; from about 10 to about 90% by wt. of a water-miscible organic solvent; from about 5 to about 90% by wt. of at least one alkanolamine; from about 0.05 to about 20% by wt. of at least one polyfunctional organic acid; and from about 0.1 to about 10% by wt. of at least one phenol-type corrosion inhibitor, wherein the composition is substantially free of hydroxylamine.

Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.