Novel acid-based chemistries that can be used in various cleaning, de-scaling, rust-removal, brightening, etching and other similar applications, including, but not limited to, those based upon hexafluorozirconic acid and other additives, such as urea in some applications, which are effective for a wide range of applications, while avoiding the health, safety and environmental issues that are often associated with the use of hydrochloric acid and other toxic chemistries.

The present invention comprises a waterless mixture which includes a biuret and/or urea, silica, and melamine particles coated with a layer of magnetite iron oxide for cleaning furnaces, heaters or boilers. A typical cleaning mixture comprises 30-50 percent silica, 20-50 percent biuret and/or urea, 20-40 percent melamine and 1-5 percent iron oxide. The cleaning can be performed at any time. This may lead to a reduction in fuel consumption, less air pollution, increased throughputs, and avoidance of equipment damage.

Solid rinsing, cleaning and/or sanitizing compositions for various applications are provided. In particular, solid compositions include a complex of urea and an acid having desirable storage stability previously unavailable in solid urea/acid compositions. Stable solid compositions are disclosed and methods of making the same to overcome conventional limitations associated with forming kinetically and thermodynamically stable solids that utilize urea/acid compositions.

An object of the present invention is to provide a cleaning composition that suppresses a surface roughness of a region including Mo and has excellent removability of Mo-based residues in a case of being used in a treatment of an Mo-containing substrate. The cleaning composition of an embodiment of the present invention is a cleaning composition used in a treatment of a molybdenum-containing substrate, the cleaning composition including an organic acid and organic amine compounds having at least one group selected from the group consisting of a primary amino group, a secondary amino group, and a tertiary amino group, in which the cleaning composition includes two or more kinds of the organic amine compounds.

A water-soluble unit dose article including a water-soluble film and at least a first internal compartment, where the internal compartment includes one or more of a first particle, where the first particle includes between about 45% and about 95% by weight of the first particle of a water-soluble carrier material selected from inorganic alkali metal salts, organic alkali metal salts, inorganic alkaline earth metal salts, organic alkaline earth metal salts, organic acids, carbohydrates, silicates, urea, and mixtures thereof; between about 1% and about 50% by weight of the first particle of a benefit agent; and less than about 20% by weight of the first particle of a surfactant.

The invention provides stabilized solutions useful as raw materials in various applications and methods for stabilizing such aqueous solutions with a stabilizer comprising one or more dialkylhydroxylamines or inorganic or organic acid salts thereof. Stabilized solutions and methods for stabilizing aqueous solutions thereof, include, for example, those of tris(2-hydroxy ethyl)methylammonium hydroxide (THEMAH) and/or carbohydrazide (CHZ).

The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains a bulky protecting ligand, an organic amine, an organic inhibitor, and water. The invention also provides methods for using the cleaning composition.

A synthetic acid composition for replacement of hydrochloric acid in industrial activities requiring large amounts of hydrochloric acid, said composition comprising: urea and hydrogen chloride in a molar ratio of not less than 0.1:1; a metal iodide or iodate; an alcohol or derivative thereof. Optionally, formic acid or a derivative thereof; propylene glycol or a derivative thereof, ethylene glycol glycerol or a mixture thereof; cinnamaldehyde or a derivative thereof; and a phosphonic acid derivative can be added to the composition.

This invention relates to cleaning of sediments and fuel remaining and in particular, to cleaning of furnaces, heaters and boilers during their operation.

Furnaces, Heaters and Boilers in different sizes and configurations are used in oil refineries, chemical plants, and power plants for supply of energy. High thermal efficiency of furnaces, heaters and boilers is critical to maximize production and minimize waste of energy.

Current cleaning methods require a shutting down of equipment, production breaks and use of scaffolding. They consist on sand or water blasting, or steel brushed and sand paper.

Those methods have significant disadvantages: damage to tubes or refractory, confined space entry, scaffolding, shut-down of the process unit, and more. The invention is based on On-Line pneumatic spraying of dry chemicals, combining chemical and mechanical cleaning simultaneously.

Performing the cleaning through existing opening in the radiant, convection, economizer, superheater, air pre-heater and other sections of the equipment obviates the need for water, confined space entry, scaffolding. Cleaning is performed On-Line during normal operating conditions; there is no need to shut down the process unit and no damage to tubes or refractory.

Chemistry is based on a blend of compounds in different ratios to achieve desired cleaning results and to maximize the cleaning effectiveness.

A cleansing wet wipe in which a base paper sheet is impregnated with a chemical liquid. The chemical liquid contains at least iodopropynyl butylcarbamate, polyamino-propyl biguanide, benzalkonium chloride, and cetylpyridinium chloride; and the content value for the iodopropynyl butylcarbamate in the chemical liquid is 0.005-0.02 mass % inclusive. The chemical liquid is adjusted to be acidic.