A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an aromatic compound represented by formula (1) and a lactam compound represented by formula (2).

##STR00001##

(in formulas (1) and (2), s represents the number of substituents R.sup.100s of the benzene ring and is 2 or 3; s groups of R.sup.100s each independently represent a C1 to C6 alkyl group; the total number of carbon atoms in s groups of C1 to C6 alkyl groups is 3 or greater; R.sup.101 represents a C1 to C6 alkyl group; and R.sup.102 represents a C1 to C6 alkylene group.)

Provided is a decomposing/cleaning composition for an adhesive polymer having a high etching rate and suppressed infiltration into a contact interface between a substrate such as a device wafer and an adhesive layer such as a fixing tape. The decomposing/cleaning composition of one embodiment is a decomposing/cleaning composition for an adhesive polymer containing a quaternary alkylammonium fluoride or a quaternary alkylammonium fluoride hydrate and an aprotic solvent, wherein the aprotic solvent contains (A) an N-substituted amide compound having no active hydrogens on the nitrogen atoms and (B) at least one organic sulfur oxide selected from the group consisting of sulfoxide compounds and sulfone compounds.

Compositions and methods for cleaning surfaces, such as for removing residues or other coatings from molds and other industrial parts, such compositions comprising, for example, a first solvent comprising a pyrrolidone such as 2-pyrrolidone, 1-(2-hydroxyethyl)-2-pyrrolidone, or mixture thereof; and a second solvent selected from the group consisting of an imidazole (such as 1,2-dimethylimidizole), an alkylene glycol ether (such as ethylene glycol monobutyl ether or diethylene glycol monobutyl ether, a terpene (such as d-limonene), and mixtures thereof. In various embodiments, such methods are for removing residues from molds used in forming polyurethane parts, wherein residues comprise polyurethane, urethane reactants, and mold release agents. The compositions may be substantially free of 1-methyl-2-pyrrolidone and of 1-ethyl-2-pyrrolidone.

Provided is a composition which has an excellent affinity with the surface of an adhesive agent and can achieve a high etching rate. The composition according to one embodiment comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and, as an aprotic solvent, (A) an N-substituted amide compound having no active hydrogen on a nitrogen atom, and (B) a dipropylene glycol dimethyl ether, wherein (B) the dipropylene glycol dimethyl ether has the percentage of a structural isomer represented by formula (1) of at least 50 mass % with respect to the total amount of (B) the dipropylene glycol dimethyl ether. ##STR00001##

A means capable of sufficiently removing residues remaining on the surface of a polished object is to be provided. The present invention relates to a surface treatment composition, containing a component (A) and a component (B) and having pH of 8.0 or more: component (A): a polymer having a constituent unit having a quaternary nitrogen-containing onium salt or a constituent unit of a structure (X) below,

##STR00001## component (B): a buffer represented by a formula: R—COO—NH.sub.4.sup.+.

This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

Process for making a powder or granule containing (A) at least one chelating agent selected from alkali metal salts of methyl glycine diacetic acid (MGDA) and of iminodisuccinic acid (IDS), (B) at least one compound of general formula (I a) or (I b)

##STR00001## wherein A.sup.1 is selected from (CH.sub.2).sub.a wherein the variable a is in the range of from 4 to 20, e is selected from zero and 1, and R.sup.1 being the same or different and selected from O—C.sub.1-C.sub.10-alkyl and C.sub.1-C.sub.10-alkyl, and, optionally, (C) at least one homo- or copolymer of (meth)acrylic acid, partially or fully neutralized with alkali, said process comprising the steps of (a) providing an aqueous solution or slurry containing chelating agent (A) and said compound (B) and, if applicable, (co)polymer (C), with a pH value in the range of from 10 to 12, (b) removing most of said water by spray drying or spray granulation.

Described are methods for removing abrasive particles from a polymeric surface, such as from a polymeric surface of a cleaning brush used in a post chemical-mechanical processing cleaning step, as well as related cleaning solutions.

The present invention provides a composition for a semiconductor device, which is excellent in residue removability. In addition, the present invention provides a substrate washing method using the treatment liquid. The composition for a semiconductor device contains alcohol, an aprotic polar solvent, an azole compound, an alkanolamine, and water.