A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C.sub.3-C.sub.6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C.sub.3-C.sub.6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

A cleaning liquid which includes 3-alkoxy-3-methyl-1-butanol represented by the following general formula (1); at least one of diethylene glycol monomethyl ether and triethylene glycol monomethyl ether; and quaternary ammonium hydroxide:

##STR00001##

in which R.sup.1 represents an alkyl group having 1 to 5 carbon atoms.

A cleaning liquid for lithography that is capable of removing residual material which remains after an etching process, as well as suppressing corrosion of at least one of cobalt and alloys thereof, and a method for cleaning a substrate using the cleaning liquid. The cleaning liquid for lithography includes hydroxylamine, at least one basic compound selected from amine compounds other than hydroxylamine, and quaternary ammonium hydroxides, and water, and has a pH value of 8 or higher. The cleaning liquid is used in cleaning a substrate containing at least one of cobalt and alloys thereof.

The present invention relates to a liquid composition comprising: a) at least one alcohol; b) at least one hydrocarbon or hydrocarbon mixture; c) at least one peroxide agent; d) water. The compositions of the invention possess antimicrobial and enhanced sporicidal properties.

Effervescent compositions are disclosed, particularly effervescent compositions useful in toilet bowls. The effervescent composition may include at least one liquid or solid hydrogen peroxide source and at least one catalyst capable of catalyzing an oxidation of the hydrogen peroxide source in the presence of a liquid, such as water. Accordingly, the effervescent composition is capable of effervescence in the presence of a liquid. The effervescent composition may also include a non-hygroscopic solvent. The presence of the non-hygroscopic solvent may assist the effervescent composition in substantially avoiding effervescence until the composition contacts the liquid. Optionally, the ratio of the hydrogen peroxide source and catalyst to the non-hygroscopic solvent is not less than 9:1.

The present application provides compositions comprising 1,2-dichloro-1,2-difluoroethylene (i.e., CFO-1112) and, optionally, an additional component. The present application further provides use of the compositions provided herein in cleaning, solvent, carrier fluid, and deposition applications.

A cleaning composition for removing cement-based residues from tiles, such as cementitious grout used for installing flooring and for filling the joints is presented. The composition includes: sulfamic acid, a glycol solvent, and water.

The present application provides compositions comprising 1,2-dichloro-1,2-difluoroethylene (i.e., CFO-1112) and, optionally, an additional component. The present application further provides use of the compositions provided herein in cleaning, solvent, carrier fluid, and deposition applications.

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.