The invention discloses a method for preparing a stainless steel seamless tube with ultra-high cleanliness for an integrated circuit and an IC industry preparation device, and a stainless steel seamless tube with ultra-high cleanliness. The stainless steel seamless tube which comprises, by mass, C0.010%, P0.020%, S0.010%, Mn0.10%, Si0.30%, Se0.010%, Al0.010%, Cu0.20%, Cr16.50-17.00%, Ni14.50-15.00%, Mo2.20-2.50%, N0.010%, Ni0.010%, Ti0.010% and the balance Fe and impurities is prepared through a: a stainless steel refining process; b: a vacuum induction melting and vacuum consumable remelting process; c: a stainless steel forging process; d: a hot piercing process; e: a cold working process; f: an inner bore electrolytic polishing, pickling and passivation process; and g: a cleaning process. The stainless steel seamless tube with ultra-high cleanliness prepared through these processes meet the requirements for ultra-high cleanliness and high performance of 316L stainless steel tubes for a semiconductor preparation device.