A heterogeneous composite consisting of near-nano ceramic clusters dispersed within a ductile matrix. The composite is formed through the high temperature compaction of a starting powder consisting of a core of ceramic nanoparticles held together with metallic binder. This core is clad with a ductile metal such that when the final powder is consolidated, the ductile metal forms a tough, near-zero contiguity matrix. The material is consolidated using any means that will maintain its heterogeneous structure.

A metal-silicon carbide-based composite material including: a composite part including a silicon carbide-based porous body constituted by a plurality of silicon carbide particles, and a metal that is infiltrated in the silicon carbide-based porous body; and first and second surface layers which contain a metal, and coat both main surfaces of the composite part. The metal contains at least one kind selected from the group consisting of aluminum and magnesium, and the amount of particles having a particle size of 300 μm or more in the plurality of silicon carbide particles is 5% by volume or less.

Various embodiments include a heat sink comprising: a base plate with an assembly surface for an electronic component; and a cooling structure bonded to the base plate increasing a surface area of the heat sink. The base plate comprises a metal-ceramic composite with a ceramic phase and a metallic phase. The cooling structure comprises a metal. A bond between the cooling structure and the base plate consists of a purely metallic bond between the cooling structure and the metallic phase of the base plate.

The present disclosure provides a powder material that makes it possible to achieve higher flowability than before and to increase the crushing strength of particles. The powder material of the present disclosure has a dendritic structure 1. The dendritic structure 1 has a cemented carbide composition or a cermet composition.

A system may include an energy delivery device and a computing device. The computing device may be configured to: control the energy delivery device to deliver energy to an abrasive coating, wherein the abrasive coating comprises a metal matrix and abrasive particles at least partially encapsulated by the metal matrix; and control the energy delivery device to scan the energy across a surface of the abrasive coating and form a series of softened or melted portions of the metal matrix.

Ceramic-metallic composites are disclosed along with the equipment and processes for their manufacture. The present invention improves the densities of these composites by eliminating porosity through the use of a unique furnace system that applies vacuum and positive gas pressure during specific stages of processing. In the fabrication of Al.sub.2O.sub.3—Al composites, each process commences with a preform initially composed of at least 5% by weight silicon dioxide, and the finished product includes aluminum oxide and aluminum, and possibly other substances.

A lightweight, selectively degradable composite material is disclosed. The composite material comprises a compacted powder mixture of a first powder, the first powder comprising first metal particles comprising Mg, Al, Mn, or Zn, or an alloy of any of the above, or a combination of any of the above, having a first particle oxidation potential, a second powder, the second powder comprising low-density ceramic, glass, cermet, intermetallic, metal, polymer, or inorganic compound second particles, and a third metal powder, the third metal powder comprising third metal particles having an oxidation potential that is different than the first particle oxidation potential. The compacted powder mixture has a microstructure comprising a matrix comprising the first metal particles, the second particles and third particles dispersed within the matrix, the third particles comprising a network of third particles extending throughout the matrix, the composite material having a density of about 3.5 g/cm.sup.3 or less.

Methods and apparatuses for in situ synthesis of SiC, CMCs, and MMCs are disclosed, comprising: providing an apparatus having: an electromagnetic energy source; an autofocusing scanner; a powder system for SiC and one or more powders; a powder delivery system; a shielding gas comprising argon and/or nitrogen; and a computer coupled to and configured to control the energy source, scanner, powder system, and powder delivery system to deposit layers of the sample; programming the computer with specifications of the sample; using the computer to control electromagnetic radiation, mixing ratio, and powder deposition parameters based on the specifications of the sample; and using the autofocusing scanner to focus and scan the electromagnetic radiation onto the sample while the powders are concurrently deposited by the powder delivery system onto the sample to create a melting pool to deposit one or more layers onto the sample. Other embodiments are described and claimed.

Methods and apparatuses for in situ synthesis of SiC, CMCs, and MMCs are disclosed, comprising: providing an apparatus having: an electromagnetic energy source; an autofocusing scanner; a powder system for SiC and one or more powders; a powder delivery system; a shielding gas comprising argon and/or nitrogen; and a computer coupled to and configured to control the energy source, scanner, powder system, and powder delivery system to deposit layers of the sample; programming the computer with specifications of the sample; using the computer to control electromagnetic radiation, mixing ratio, and powder deposition parameters based on the specifications of the sample; and using the autofocusing scanner to focus and scan the electromagnetic radiation onto the sample while the powders are concurrently deposited by the powder delivery system onto the sample to create a melting pool to deposit one or more layers onto the sample. Other embodiments are described and claimed.

A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.0, where a preferred thermal stress resistance could be designed for making highly hermetic sealed electronic package.