A three-dimensional shaped article production method according to the invention is a method for producing a three-dimensional shaped article by stacking layers formed in a predetermined pattern, wherein a series of steps including a composition supply step of supplying a composition containing a plurality of particles to a predetermined part, and a bonding step of bonding the particles by irradiation with a laser light is performed repeatedly, and the composition supply step includes a step of forming a first region using a first composition containing first particles as the composition, and a step of forming a second region using a second composition containing second particles which are different from the first particles as the composition, and the bonding of the particles in the first region and the bonding of the particles in the second region are performed by irradiation with laser lights with a different spectrum.

A method for producing an article containing silicon carbide as the main constituent includes a plurality of sets of steps of forming a layer of a raw material powder and irradiating the layer with laser light according to three-dimensional model data. The low material powder is a mixture of silicon carbide powder, metallic silicon powder, and carbon powder. The laser light used in the step of irradiation with laser light has a spatial laser power density of 11 J/mm.sup.3 to 50 J/mm.sup.3.

To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 m and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.

A composite material contains a metallic phase, a non-metallic phase and a specific element. At least 90 mass % of the metallic phase is composed of at least one selected from the group consisting of Ag and Cu. The non-metallic phase includes a coated core material. The coated core material includes a core material and a carbide layer that covers at least a part of a surface of the core material. The core material contains at least one carbon-containing material selected from the group consisting of diamond, graphite, carbon fibers, and silicon carbide. The carbide layer contains a carbide of at least one metal element selected from the group consisting of Ti, Cr, Ta, and V. The specific element is at least one selected from the group consisting of Y and Mg. A total content of the specific element is 0.0004 mass % to 1.3 mass %.

A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.

A computer-controlled method of component manufacture is disclosed, which includes winding a thread of material around a shaping element to form a first layer formed of adjacent turns of the thread. The winding is repeated to form a second layer of adjacent turns of the thread on top of the first layer. A laser beam is then applied between adjacent turns of each layer to attach them at predetermined points.

A method for fabricating a ceramic material includes impregnating a porous structure with a mixture that includes a preceramic polymer and a filler. The filler includes at least one free metal. The preceramic polymer material is then rigidized to form a green body. The green body is then thermally treated to convert the rigidized preceramic polymer material into a ceramic matrix located within pores of the porous structure. The same thermal treatment or a second, further thermal treatment is used to cause the at least one free metal to move to internal porosity defined by the ceramic matrix or pores of the porous structure.

A method for fabricating a ceramic material includes impregnating a porous structure with a mixture that includes a preceramic polymer and a filler. The filler includes at least one free metal. The preceramic polymer material is then rigidized to form a green body. The green body is then thermally treated to convert the rigidized preceramic polymer material into a ceramic matrix located within pores of the porous structure. The same thermal treatment or a second, further thermal treatment is used to cause the at least one free metal to move to internal porosity defined by the ceramic matrix or pores of the porous structure.

The present disclosure relates to an electrostatic chuck and a method of manufacturing the same. A problem in that the yield of a wafer is reduced due to a partial destruction phenomenon attributable to thermal expansion of an electrostatic chuck is solved and the lifespan of a wafer is increased by making a coefficient of thermal expansion of a lower plate of an electrostatic chuck similar to a coefficient of thermal expansion of an upper plate of the electrostatic chuck.

A composite material includes a continuous phase and a silicon carbide filler. The continuous phase is made of a metal or a synthetic resin. The silicon carbide filler is dispersed in the continuous phase and includes dendritic crystals having a circularity in a cross-sectional view of less than 0.206. A semiconductor device includes a semiconductor element and a bonded member formed from the composite material into a plate shape or a layer shape and bonded to the semiconductor element.