Provided is a process for producing a tinned copper wire. The process comprises subjecting a copper wire sequentially to activation treatment, a first hot tinning treatment, a first cooling, a second hot tinning treatment, and a second cooling to obtain a tinned copper wire. The first hot tinning treatment is carried out at a first temperature and the second hot tinning treatment is carried out at a second temperature. The first temperature is higher than the second temperature. The first temperature is at least 38° C. higher than the melting point of tin. The second temperature is at least 8° C. higher than the melting point of tin.

Provided is a process for producing a tinned copper wire. The process comprises subjecting a copper wire sequentially to activation treatment, a first hot tinning treatment, a first cooling, a second hot tinning treatment, and a second cooling to obtain a tinned copper wire. The first hot tinning treatment is carried out at a first temperature and the second hot tinning treatment is carried out at a second temperature. The first temperature is higher than the second temperature. The first temperature is at least 38° C. higher than the melting point of tin. The second temperature is at least 8° C. higher than the melting point of tin.

A component for a processing chamber includes a ceramic body having at least one surface with a first average surface roughness. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness that is less than the first average surface roughness.

A component for a processing chamber includes a ceramic body having at least one surface with a first average surface roughness. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness that is less than the first average surface roughness.

Induction heating facilitated coating systems and processes for pipes overcome corrosion and erosion of the pipes at extreme temperatures and pressures in applications including oil and gas downhole tubulars and pipelines as well as processing facilities. Being based on vitreous fused inorganic compounds, the present invention achieves very high corrosion resistance at remarkably modest cost. Attractive economics and immunity to chlorides and moisture permeation at extreme concentrations and temperatures also make it well suited to desalination plants and potable water piping applications. Due to its extreme temperature resistance, it also is very well suited for geothermal wells. Additionally, due to its characteristic smooth durable surface, the present invention is ideally suited for applications involving the opposite of corrosion, namely scaling problems, such as fouling in sewage systems and scale buildup in heavy oil wells.

Induction heating facilitated coating systems and processes for pipes overcome corrosion and erosion of the pipes at extreme temperatures and pressures in applications including oil and gas downhole tubulars and pipelines as well as processing facilities. Being based on vitreous fused inorganic compounds, the present invention achieves very high corrosion resistance at remarkably modest cost. Attractive economics and immunity to chlorides and moisture permeation at extreme concentrations and temperatures also make it well suited to desalination plants and potable water piping applications. Due to its extreme temperature resistance, it also is very well suited for geothermal wells. Additionally, due to its characteristic smooth durable surface, the present invention is ideally suited for applications involving the opposite of corrosion, namely scaling problems, such as fouling in sewage systems and scale buildup in heavy oil wells.

A component for a semiconductor processing chamber includes a ceramic body having at least one surface with a first average surface roughness of approximately 8-16 micro-inches. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 m over the at least one surface and having a second average surface roughness of below 10 micro-inches, wherein the second average surface roughness is less than the first average surface roughness.

A component for a semiconductor processing chamber includes a ceramic body having at least one surface with a first average surface roughness of approximately 8-16 micro-inches. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 m over the at least one surface and having a second average surface roughness of below 10 micro-inches, wherein the second average surface roughness is less than the first average surface roughness.

This invention relates to thermal spray coatings and processes onto non-smooth surfaces. The coating and processes can coat non-smooth surfaces without substantial degradation of the underlying surface texture or profile of the non-smooth surfaces so as to sufficiently preserve the underlying surface texture or profile. The ability for coating fractional coverage to maintain the surface profile while maintaining wear resistance is unprecedented by conventional thermal spray processes.

This invention relates to thermal spray coatings and processes onto non-smooth surfaces. The coating and processes can coat non-smooth surfaces without substantial degradation of the underlying surface texture or profile of the non-smooth surfaces so as to sufficiently preserve the underlying surface texture or profile. The ability for coating fractional coverage to maintain the surface profile while maintaining wear resistance is unprecedented by conventional thermal spray processes.