C23C8/24

Cyclic Low Temperature Film Growth Processes

A method of nitridation includes cyclically performing the following steps in situ within a processing chamber at a temperature less than about 400° C.: directing an energy flux to a localized region of an unreactive surface of a substrate to convert the localized region of the unreactive surface to a localized reactive region: and selectively nitridating the localized reactive region using a nitrogen-based gas to convert the localized reactive region to a nitride layer.

FRACTURABLE SUPPORT STRUCTURE AND METHOD OF FORMING THE STRUCTURE
20230201928 · 2023-06-29 · ·

An embodiment of the present disclosure is directed to a method of additive manufacturing. The method comprises: i) forming a first layer, the first layer comprising at least one material chosen from an article material, a support structure material and a fracturable material; ii) forming an additional layer on the first layer, the additional layer comprising at least one material chosen from the article material, the support structure material and the fracturable material; and iii) repeating ii) one or more times to form a three-dimensional build comprising an article and at least one support structure attached to the article at an interface, the interface comprising the fracturable material formed during one or more of i), ii) or iii), the fracturable material being formed by exposing a print material with a gas reactant. A three-dimensional build is also disclosed.

FRACTURABLE SUPPORT STRUCTURE AND METHOD OF FORMING THE STRUCTURE
20230201928 · 2023-06-29 · ·

An embodiment of the present disclosure is directed to a method of additive manufacturing. The method comprises: i) forming a first layer, the first layer comprising at least one material chosen from an article material, a support structure material and a fracturable material; ii) forming an additional layer on the first layer, the additional layer comprising at least one material chosen from the article material, the support structure material and the fracturable material; and iii) repeating ii) one or more times to form a three-dimensional build comprising an article and at least one support structure attached to the article at an interface, the interface comprising the fracturable material formed during one or more of i), ii) or iii), the fracturable material being formed by exposing a print material with a gas reactant. A three-dimensional build is also disclosed.

PRESERVATION OF STRAIN IN IRON NITRIDE MAGNET
20170365381 · 2017-12-21 ·

A permanent magnet may include a Fe16N2 phase in a strained state. In some examples, strain may be preserved within the permanent magnet by a technique that includes etching an iron nitride-containing workpiece including Fe16N2 to introduce texture, straining the workpiece, and annealing the workpiece. In some examples, strain may be preserved within the permanent magnet by a technique that includes applying at a first temperature a layer of material to an iron nitride-containing workpiece including Fe16N2, and bringing the layer of material and the iron nitride-containing workpiece to a second temperature, where the material has a different coefficient of thermal expansion than the iron nitride-containing workpiece. A permanent magnet including an Fe16N2 phase with preserved strain also is disclosed.

STEEL AND STEEL COMPONENT

Provided is steel for nitrocarburizing with excellent surface fatigue strength. The steel has a nitride compound layer with a thickness of 5.0 μm to 30.0 μm and a hardened layer in an order from a steel surface to steel inside, where a thickness of a porous layer on an outermost surface of the compound layer is 3.0 μm or less and 40.0% or less of a compound layer's thickness, the hardened layer has hardness of HV600 or more, HV400 or more and HV250 or more at 50 μm inward from the steel surface, from the steel surface to the steel inside of 400 μm, and from the steel surface to the steel inside of 600 μm, respectively, an unhardened portion excluding the compound and hardened layers has a predetermined chemical composition, and the hardened layer has a chemical composition with a higher N content than the unhardened portion.

TITANIUM ALLOY MEMBER AND METHOD FOR MANUFACTURING THE SAME
20170356076 · 2017-12-14 ·

There is provided a titanium alloy member including a base metal portion, and an outer hardened layer formed on an outer layer of the base metal portion, the cross sectional hardness of the base metal portion is 330 HV or higher and lower than 400 HV, the cross sectional hardnesses at positions 5 μm and 15 μm from the surface of the outer hardened layer are 450 HV or higher and lower than 600 HV, the outer hardened layer includes an oxygen diffusion layer and a nitrogen diffusion layer, the oxygen diffusion layer is at a depth of 40 to 80 μm from the surface of the outer hardened layer, and the nitrogen diffusion layer is at a depth of 2 to 5 μm from surface of the outer hardened layer. This titanium alloy member includes an outer hardened layer, is high in cross sectional hardness of the base metal portion, and is excellent in fatigue strength and wear resistance.

TITANIUM ALLOY MEMBER AND METHOD FOR MANUFACTURING THE SAME
20170356076 · 2017-12-14 ·

There is provided a titanium alloy member including a base metal portion, and an outer hardened layer formed on an outer layer of the base metal portion, the cross sectional hardness of the base metal portion is 330 HV or higher and lower than 400 HV, the cross sectional hardnesses at positions 5 μm and 15 μm from the surface of the outer hardened layer are 450 HV or higher and lower than 600 HV, the outer hardened layer includes an oxygen diffusion layer and a nitrogen diffusion layer, the oxygen diffusion layer is at a depth of 40 to 80 μm from the surface of the outer hardened layer, and the nitrogen diffusion layer is at a depth of 2 to 5 μm from surface of the outer hardened layer. This titanium alloy member includes an outer hardened layer, is high in cross sectional hardness of the base metal portion, and is excellent in fatigue strength and wear resistance.

EFFECTIVE AND NOVEL DESIGN FOR LOWER PARTICLE COUNT AND BETTER WAFER QUALITY BY DIFFUSING THE FLOW INSIDE THE CHAMBER

Embodiments described herein generally relate to a processing chamber having one or more gas inlet ports located at a bottom of the processing chamber. Gas flowing into the processing chamber via the one or more gas inlet ports is directed along a lower side wall of the processing chamber by a plate located over each of the one or more gas inlet ports or by an angled opening of each of the one or more gas inlet ports. The one or more gas inlet ports and the plates may be located at one end of the processing chamber, and the gas flow is directed towards an exhaust port located at the opposite end of the processing chamber by the plates or the angled openings. Thus, more gas can be flowed into the processing chamber without dislodging particles from a lid of the processing chamber.

EFFECTIVE AND NOVEL DESIGN FOR LOWER PARTICLE COUNT AND BETTER WAFER QUALITY BY DIFFUSING THE FLOW INSIDE THE CHAMBER

Embodiments described herein generally relate to a processing chamber having one or more gas inlet ports located at a bottom of the processing chamber. Gas flowing into the processing chamber via the one or more gas inlet ports is directed along a lower side wall of the processing chamber by a plate located over each of the one or more gas inlet ports or by an angled opening of each of the one or more gas inlet ports. The one or more gas inlet ports and the plates may be located at one end of the processing chamber, and the gas flow is directed towards an exhaust port located at the opposite end of the processing chamber by the plates or the angled openings. Thus, more gas can be flowed into the processing chamber without dislodging particles from a lid of the processing chamber.

Deposition of silicon boron nitride films

Methods for forming a SiBN film comprising depositing a film on a feature on a substrate. The method comprises in a first cycle, depositing a SiB layer on a substrate in a chamber using a chemical vapor deposition process, the substrate having at least one feature thereon, the at least one feature comprising an upper surface, a bottom surface and sidewalls, the SiB layer formed on the upper surface, the bottom surface and the sidewalls. In a second cycle, the SiB layer is treated with a plasma comprising a nitrogen-containing gas to form a conformal SiBN film.