A device may include one or more memories and one or more processors, communicatively coupled to the one or more memories, to receive design information, wherein the design information identifies desired values for a set of layers of an optical element to be generated during one or more runs; receive or obtain historic information identifying a relationship between a parameter for the one or more runs and an observed value relating to the one or more runs or the optical element; determine layer information for the one or more runs based on the historic information, wherein the layer information identifies run parameters, for the set of layers, to achieve the desired values; and cause the one or more runs to be performed based on the layer information.

A method for coating substrates with a decorative layer of hard material which is guided into a vacuum coating chamber. The decorative layer of hard material is deposited by a reactive HIPIMS-process, and the energy content in the power pulses is controlled in such a manner that the deposited layer of hard material has a homogeneous colour, a high degree of smoothness and a high strength.

There is provided a technique that includes: (a) processing a substrate by executing a processing program stored in a memory; (b) inspecting and determining whether the processing program is infected with a computer virus; and (c) executing at least one interruption program stored in the memory and configured to interrupt the processing program when the processing program is determined to be infected with the computer virus.

A MgO layer is formed using a process flow wherein a Mg layer is deposited at a temperature <200° C. on a substrate, and then an anneal between 200° C. and 900° C., and preferably from 200° C. and 400° C., is performed so that a Mg vapor pressure >10.sup.−6 Torr is reached and a substantial portion of the Mg layer sublimes and leaves a Mg monolayer. After an oxidation between −223° C. and 900° C., a MgO monolayer is produced where the Mg:O ratio is exactly 1:1 thereby avoiding underoxidized or overoxidized states associated with film defects. The process flow may be repeated one or more times to yield a desired thickness and resistance×area value when the MgO is a tunnel barrier or Hk enhancing layer. Moreover, a doping element (M) may be added during Mg deposition to modify the conductivity and band structure in the resulting MgMO layer.

A reflective mask blank including a substrate, a multilayer reflection film consisting of at least two first layers and at least two second layers that are laminated alternatively and having different optical properties each other, and an absorber film are manufactured by a sputtering method. Each layer is formed by two stages consisting of a first stage applied from when the forming of each layer is started and until a prescribed thickness is formed, and a second stage applied from when the prescribed thickness is formed and until the forming of each layer is completed, and a sputtering pressure of the first stage is set to higher than both a sputtering pressure at which the forming of the layer formed just before is completed, and a sputtering pressure of the second stage.

A supercapacitor with both current collector and electrode based on transition metal nitride and the preparation method therefor is disclosed. First, the substrates were subjected to a standard cleaning technique to remove impurities and contaminations on the surface; then a layer of transition metal nitride film with high density and conductivity was deposited on the surface of substrates as a current collector to transport electrons. By simply adjusting the deposition process parameters, a rough and porous transition metal nitride film with high resistivity was grown directly on the current collector as active electrode material. In this invention, the transition metal nitrides were grown continuously as the current collector and then as the electrode materials, and the properties of these two materials can be tailored easily by changing the deposition process parameters.

A method for forming a film of an oxide of In, Ga, and Zn, having a spinel crystalline phase comprises providing a substrate in a chamber; providing a sputtering target in said chamber, the target comprising an oxide of In, Ga, and Zn, wherein: In, Ga, and Zn represent together at least 95 at % of the elements other than oxygen, In represents from 0.6 to 44 at % of In, Ga, and Zn, Ga represents from 22 to 66 at % of In, Ga, and Zn, and Zn represents from 20 to 46 at % of In, Ga, and Zn; and forming a film on the substrate, the substrate being at a temperature of from 125° C. to 250° C., by sputtering the target with a sputtering gas comprising O.sub.2, the sputtering being performed at a sputtering power of at least 200 W.

A coated body having a substrate and a wear-resistant coating applied to the substrate by physical vapor deposition, the coating comprising a main layer applied to the substrate in a thickness of 1 to 10 μm, wherein said main layer is formed from a nitride of aluminum and at least one other metal from the group consisting of Ti, Cr, Si, Zr and combinations thereof; and a cover layer adjacent to the main layer at a thickness of 0.1 to 5 μm, wherein the cover layer comprises at least one alternating layer consisting of an oxynitride layer and a nitride layer arranged over the oxynitride layer, wherein the oxynitride layer is formed from an oxynitride of aluminum and optionally further metals from the group consisting of chromium, hafnium, zirconium, yttrium, silicon and combinations thereof, and the nitride layer is formed from a nitride of aluminum and at least one other metal from the group consisting of Ti, Cr, Si, Zr and combinations thereof.

A method of forming an internal stress control film on one surface of an object to be processed by a sputtering method, includes selecting a pressure of a process gas at the time of forming the internal stress control film from a pressure region higher than a threshold value of 5 (Pa) so that stress of the object to be processed when a bias is applied to the object to be processed becomes larger stress on a tensile side and the internal stress control film has higher density, as compared with stress in a case in which a bias is not applied thereto.

A mask strip, an array substrate, a display screen, and a display device. The mask strip is used for fabricating a light emitting structure layer on an array substrate. The mask strip includes a plurality of sub-masks, and each of the plurality of the sub-masks includes a first mask region and a second mask region, the first mask region has a plurality of first mask openings, the second mask region has a plurality of second mask openings. A second density of the second mask openings in the second mask region is less than a first density of the first mask openings in the first mask region, a second size of each of at least part of the second mask openings is larger than a first size of each of the plurality of first mask openings.