Methods and apparatus for processing a substrate are provided. For example, a method includes sputtering a material from a target in a PVD chamber to form a material layer on a layer comprising a feature of the substrate, the feature having an opening width defined by a first sidewall and a second sidewall, the material layer having a greater lateral thickness at the top surface of the layer than a thickness on the first sidewall or the second sidewall within the feature, depositing additional material on the layer by biasing the layer with an RF bias at a low power, etching the material layer from the layer by biasing the layer with an RF bias at a high-power, and repeatedly alternating between the low power and the high-power at a predetermined frequency.

A deposition system includes a system housing having a housing interior, a fixture transfer assembly having a generally sloped fixture transfer rail extending through the housing interior, a plurality of sequentially ordered deposition chambers connected by the fixture transfer rail, a controller interfacing with the processing chambers and at least one fixture carrier assembly carried by the fixture transfer rail and adapted to contain at least one substrate. The fixture carrier assembly travels along the fixture transfer rail under influence of gravity. A substrate fixture contains a substrate. The substrate fixture comprises a fixture frame. The fixture frame is defined by multiple circular members adjacently joined in a circular arrangement. Each circular member has a fixture frame opening sized to receive the substrate. Lens support arms may integrate into the circular members, extending in a curved disposition into the fixture frame opening to retain the substrate. A deposition method is also disclosed.

Methods for producing layered nanocarbon structures placing a workpiece in a working chamber, applying a vacuum to the chamber, processing the workpiece surface with gas ions, applying a material sublayer to the workpiece surface, depositing carbon ions from a carbon plasma on the workpiece surface to apply an amorphous diamond-like sp3 carbon coating layer on the workpiece surface. The methods include irradiating the growing carbon coating with accelerated ions of an inert gas at a first energy range to apply a graphite sp2 carbon coating layer on the sp3 carbon coating layer and irradiating the growing carbon coating with accelerated ions of the inert gas at a second energy range, different from the first energy range, to apply a linear chain and polymer sp1 carbon coating layer on the sp2 carbon coating layer.

The present disclosure relates to coated non-metallic substrates and coated metallic substrates, and methods for producing such coated substrates. A variant of the method is characterized in that a mat or glossy coating is underneath a metallic layer obtained in some cases by way of vapor deposition and/or sputtering. In another variant, the metallic is sufficiently thin so that it remains transparent or translucent to visible light. The coated substrates may include multiple layers such as metallic layers, polysiloxane layers, a color layer, a conversion layer, a primer layer, and/or a transparent or colored layer. An application system for applying a metallic layer to at least one surface of a substrate may include a plasma generator and/or a corona system for treating one or more layers by plasma treatment and/or corona treatment.

A device for a plasma processing chamber includes a base, an upper portion attached to the base and extending transverse to the base, and one or more first through holes defined in the base. The one or more first through holes correspond to one or more openings defined in the plasma processing chamber for attaching the device. The device further includes a second through hole defined in the upper portion, and a gauge located in the second through hole, the gauge configured for recording a position of the plasma processing chamber and a shift in the position of the plasma processing chamber.

The present disclosure relates to a structural coating and preparation method and use thereof. The structural coating provided in the present disclosure includes a titanium transition layer and platinum-hafnium composite structure layers laminated in sequence on a surface of a substrate; the number of the platinum-hafnium composite structure layer is ≥3; the platinum-hafnium composite structure layer includes a hafnium layer and a platinum layer laminated in sequence.

The coated cutting tool comprises a substrate and a coating layer formed on a surface of the substrate, the coating layer comprises an alternating laminate structure in which two or more first layers and two or more second layers are alternately laminated, the first layer is a compound layer containing Ti(C.sub.aN.sub.1-a), the second layer is a compound layer containing (Ti.sub.xAl.sub.1-x)(C.sub.yN.sub.1-y), an average thickness per layer of each of the first layers and the second layers in the alternating laminate structure is 3 nm or more and 300 nm or less, and an average thickness of the alternating laminate structure is 1.0 μm or more and 8.0 μm or less.

The invention relates to an optical article having a Bayer value determined in accordance with the ASTM F735-81 standard higher than or equal to 7, comprising a substrate having at least one main face successively coated with a monolayer sub-layer having a thickness higher than or equal to 250 nm and a multilayer interferential coating comprising a stack of at least one high refractive index layer having a refractive index higher than 1.55 and at least one low refractive index layer having a refractive index of 1.55 or less. The ratio: (I) is higher than or equal to 1.5, and/or the deposition of the high refractive index layer of the interferential coating having a refractive index higher than 1.55 and a thickness higher than or equal to 15 nm that is the furthest from the substrate has been carried out under ionic assistance.

[00001]$\begin{array}{cc}{R}_D=\frac{\begin{array}{c}\mathrm{thickness}\mathrm{of}\mathrm{the}\mathrm{outermost}\mathrm{low}\mathrm{refractive}\mathrm{index}\\ \mathrm{layer}\left(s\right)\mathrm{of}\mathrm{the}\mathrm{interferential}\mathrm{coating}\end{array}}{\begin{array}{c}\mathrm{thickness}\mathrm{of}\mathrm{the}\mathrm{outermost}\mathrm{high}\mathrm{refractive}\mathrm{index}\\ \mathrm{layer}\left(s\right)\mathrm{of}\mathrm{the}\mathrm{interferential}\mathrm{coating}\end{array}}& \left(I\right)\end{array}$

Certain examples described herein relate to a sputter deposition apparatus including a guiding member to guide a substrate in a conveyance direction, a plasma source to generate a plasma, and a magnet arrangement. The magnet arrangement is configured to confine the plasma within the apparatus to a pre-treatment zone, within which the substrate is exposed to the plasma in use. The magnet arrangement is also configured to confine the plasma within the apparatus to a sputter deposition zone, located after the pre-treatment zone in the conveyance direction, to provide for sputter deposition of a target material to the substrate in use. The pre-treatment and sputter deposition zones are disposed about the guiding member.

A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.