A powder conveying apparatus, a gas supply apparatus, and a method for removing powder that suppresses internal leakage are provided.

A powder conveying apparatus includes a powder transport line via which a powder feedstock source is coupled to a vaporizer, and includes a first valve provided on a powder feedstock source-side of the powder transport line. The powder conveying apparatus includes a second valve provided on a vaporizer-side of the powder transport line, and includes a buffer tank configured to be filled with a purge gas. The powder conveying apparatus includes a first purge-gas supply line coupled to the powder transport line upstream of the second valve, the first purge-gas supply line enabling the purge gas to be supplied from the buffer tank to the second valve. The powder conveying apparatus includes a first purge gas valve provided on the first purge-gas supply line. The powder conveying apparatus includes a controller configured to control opening and closing of the first valve, the second valve, and the first purge gas valve.

A cabinet for a solid material container comprises a main body having a top wall, a side wall, and a bottom wall; an entry/exit portion which is attached to a portion of the main body, for putting in and taking out the solid material container; an exhaust duct attached to a portion of the main body; a heating portion for heating the solid material container; a temperature measuring portion for measuring a temperature of the solid material container, or of the heating portion; and a cooling blower for blowing cooling air toward the solid material container.

Systems and methods for additive manufacturing, and, in particular, such methods and apparatus as employ pulsed lasers or other heating arrangements to create metal droplets from donor metal micro wires, which droplets, when solidified in the aggregate, form 3D structures. A supply of metal micro wire is arranged so as to be fed towards a nozzle area by a piezo translator. Near the nozzle, an end portion of the metal micro wire is heated (e.g., by a laser pulse or an electric heater element), thereby causing the end portion of the metal micro wire near the nozzle area to form a droplet of metal. A receiving substrate is positioned to receive the droplet of metal jetted from the nozzle area.

A vapor deposition source for a vacuum vapor deposition apparatus according to the present invention disposed in a vacuum chamber to evaporate a solid vapor deposition material to be vapor-deposited on an object to be subjected to vapor deposition includes: a crucible configured to accommodate the vapor deposition material therein and having a discharge port through which the evaporated vapor deposition material is discharged toward the object to be subjected to vapor deposition; and a heating means configured to heat the vapor deposition material in the crucible. In the crucible, an evaporation facilitator is provided, a partial portion of the evaporation facilitator being immersed in the vapor deposition material liquefied by heating, with a gap between the remaining portion of the evaporation facilitator and an inner surface of the crucible.

Disclosed are an apparatus for and a method of manufacturing a semiconductor device. The apparatus includes a chamber, an evaporator that evaporates an organic source to provide a source gas on a substrate in the chamber, a vacuum pump that pumps the source gas and air from the chamber, an exhaust line between the vacuum pump and the chamber, and an analyzer connected to the exhaust line. The analyzer detects a derived molecule produced from the organic source and determines a replacement time of the evaporate

A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns;

a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

A vacuum deposition facility is provided for continuously depositing on a running substrate coatings formed from metal alloys including a main element and at least one additional element. The facility includes a vacuum deposition chamber and a substrate running through the chamber. The facility also includes a vapor jet coater, an evaporation crucible for feeding the vapor jet coater with a vapor having the main element and the at least one additional element, a recharging furnace for feeding the evaporation crucible with the main element in molten state and maintaining a constant level of liquid in the evaporation crucible, and a feeding unit being fed with the at least one additional element in solid state for feeding the evaporation crucible with the at least one additional element either in molten state, in solid state or partially in solid state. A process is also provided.

A method to operate an apparatus for feeding liquid metal to an evaporator device in a vacuum chamber, wherein the feed tube runs from a container adapted to contain a liquid metal to the evaporator device and wherein an electromagnetic pump is provided in the feed tube and a valve in the feed tube between the electromagnetic pump and the evaporator device. An at least partially gas permeable electromagnetic pump, which is enclosed in a pressure controlled enclosure, is used in the method wherein electromagnetic pump and the pressure controlled enclosure are controlled such that filling and draining of the evaporator device and feed tube can be done without affecting the vacuum pressure in the vacuum chamber.

Provided is a multilayered zinc alloy plated steel material comprising a base iron and multilayered plated layers formed on the base iron, wherein each of the multilayered plated layers is any one of a Zn-plated layer, a Mg-plated layer, and a Zn—Mg alloy-plated layer, and the ratio of the weight of Mg contained in the multilayered plated layers is 0.13-0.24 on the basis of the total weight of the multilayered plated layers.

An evaporation apparatus (100) is described, particularly for evaporating a reactive material such as lithium. The evaporation apparatus (100) includes an evaporation crucible (110) for evaporating a liquid material (105), a material conduit (120) for supplying the liquid material (105) to the evaporation crucible (110), and a valve (150) configured to close the material conduit (120) by solidifying a part of the liquid material (105) in the material conduit (120) with a cooling device (152). The valve (150) may include a cooling gas supply (154) for a cooling gas (106), and the cooling device (152) may be configured to cool the liquid material (105) with the cooling gas (106). Further described are a vapor deposition apparatus (200) for coating a substrate as well as an evaporation method.