A negative thermal expansion material and a preparation method thereof, and a negative thermal expansion film and a preparation method thereof are provided. The negative thermal expansion material includes Eu.sub.0.85Cu.sub.0.15MnO.sub.3-δ, wherein 0≤δ≤2.

A light absorption film. The light absorption film is a titanium-aluminum-nitride film, including a bottom layer and an outer layer; the bottom layer has a nano-layered structure, the outer layer has a columnar crystal structure, and the top of the columnar crystal structure is a conical surface; within a light wavelength range of 200 nm to 2500 nm, the light absorption film has an average light absorption rate (α) of not less than 0.89. After adding an antireflection layer of TiAlON, TiO.sub.2 or SiO.sub.2 to the outer layer of the light absorption film, the average light absorption rate (α) is not less than 0.95 within the light wavelength range of 200 nm to 2500 nm. The light absorption film has advantages of such as a wide frequency range for light absorption, a high absorption rate, and stable physical and chemical properties of the film in adverse environments.

Thin films of lithium-containing materials and methods for fabricating them are generally described. In some embodiments, the formation of a first vapor is induced from a first target and the formation of a second vapor is induced from a second target, resulting in the formation of a thin film. In some embodiments, at least a portion of the formation of the first vapor and the formation of the second vapor occurs under vacuum conditions. In some embodiments, the thin film has a relatively high ionic conductivity, mixed ionic/electronic conductivity, or other properties beneficial for applications such as active electrode materials or solid-state electrolytes.

Embodiments of a process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a multi-cathode processing chamber includes: a first rotatable shield coupled to a first shaft, wherein the first rotatable shield includes a base, a conical portion extending downward and radially outward from the base, and one or more holes formed through the conical portion, wherein no two holes of the one or more holes are diametrically opposed; and a second rotatable shield coupled to a second shaft concentric with the first shaft, wherein the second rotatable shield is disposed in the first rotatable shield, and wherein the first rotatable shield is configured to rotate independent of the first rotatable shield.

Techniques are provided for making a coated article including an antibacterial and/or antifungal coating. In certain example embodiments, the method includes providing a first sputtering target including Zr; providing a second sputtering target including Zn; and co-sputtering from at least the first and second sputtering targets in the presence of nitrogen to form a layer including Zn.sub.xZr.sub.yN.sub.z on a glass substrate. These layers may be heat-treated or thermally tempered to form a single layer including Zn.sub.xZr.sub.yO.sub.z. In other examples, two discrete layers of Zn and Zr may be formed. The coating may be heated or tempered to form a single layer including Zn.sub.xZr.sub.yO.sub.z. Coated articles made using these methods may have antibacterial and/or antifungal properties.

A composite coating layer for coating a NdFeB rare earth magnet includes a first coating layer and a second coating layer formed over a surface of the first coating layer. The first coating layer includes a Nd coating layer, a Pr coating layer, or an alloy coating layer including two or more of Nd, Pr, and Cu. The second coating layer includes a Tb coating layer.

A method for manufacturing catalyst material is provided, which includes putting an M′ target and an M″ target into a nitrogen-containing atmosphere, in which M′ is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, and M″ is Nb, Ta, or a combination thereof. Powers are provided to the M′ target and the M″ target, respectively. Providing ions to bombard the M′ target and the M″ target to sputtering deposit M′.sub.aM″.sub.bN.sub.2 on a substrate, wherein 0.7≤a≤1.7, 0.3≤b≤1.3, and a+b=2, wherein M′.sub.aM″.sub.bN.sub.2 is a cubic crystal system.

An inorganic solid-state electrochromic module containing an inorganic transparent conductive film, including a transparent substrate and a first transparent conductive layer, a first transparent metal layer, a first transparent protective layer, an inorganic electrochromic layer, an inorganic ion conductive layer, an inorganic ion storage layer, a second transparent metal layer, a second transparent protective layer, a second transparent conductive layer, a encapsulating film and a transparent front plate successively formed on the transparent substrate.

A cover glass includes a glass substrate and an antireflection film disposed on at least one of main surfaces of the glass substrate, and the at least one of main surfaces of the glass substrate has one or more cracks formed therein, the crack(s) each having a length of 5 μm or less, and a difference Δa* in a* value between any two points within a surface of the cover glass on the side where the antireflection film has been disposed and a difference Δb* in b* value between any two points within the surface of the cover glass on the side where the antireflection film has been disposed satisfy the following expression: √{(Δa*).sup.2+(Δb*).sup.2}≤4.

A structure in which a plurality of particles each containing a hydrogen absorption metal element are arranged in a fixed member such that the plurality of particles are apart from each other. An entire surface of each of the plurality of particles is surrounded by the fixed member. The fixed member contains at least one of an oxide and a nitride.