A system for depositing coating on a workpiece includes a deposition chamber within which is formed a vortex to at least partially surround a workpiece therein.

A sputter deposition method includes sputtering a first target material onto a web substrate moving through a first process module while heating the substrate, providing the substrate from the first process module to a connection unit containing a roller assembly including a plurality of cylindrical rollers, bending the substrate at an angle of 10 to 40 around the roller assembly in the connection unit, providing the substrate from the connection unit to a second process module, and sputtering a second target material onto the substrate moving through the second process module while heating the substrate.

A deposition system includes a system housing having a housing interior, a fixture transfer assembly having a generally sloped fixture transfer rail extending through the housing interior, a plurality of sequentially ordered deposition chambers connected by the fixture transfer rail, a controller interfacing with the processing chambers and at least one fixture carrier assembly carried by the fixture transfer rail and adapted to contain at least one substrate. The fixture carrier assembly travels along the fixture transfer rail under influence of gravity. A substrate fixture contains a substrate. The substrate fixture comprises a fixture frame. The fixture frame is defined by multiple circular members adjacently joined in a circular arrangement. Each circular member has a fixture frame opening sized to receive the substrate. Lens support arms may integrate into the circular members, extending in a curved disposition into the fixture frame opening to retain the substrate. A deposition method is also disclosed.

An electron beam vapor deposition process for depositing coatings comprises placing a source coating material in a crucible of a vapor deposition apparatus having a coating chamber; pressurizing said coating chamber from about 0.5 microbar to about 40 microbar; heating a work piece surface to a temperature of from 1800 degrees Fahrenheit to 2000 degrees Fahrenheit; energizing said source coating with an electron beam that delivers a power density to the material in the crucible forming a vapor cloud from said source coating material; and depositing said source coating material onto a surface of a work piece.

A cooling device includes a tank, a first path configured to circulate a liquid-phase refrigerant by a pump so as to extract the liquid-phase refrigerant from the tank, cool the liquid-phase refrigerant, and return the liquid-phase refrigerant to the tank, and a second path branched from the first path. The second path includes a heater configured to heat the liquid-phase refrigerant supplied from the first path, a throttle configured to decrease a pressure of the refrigerant heated by the heater, and a vaporizer configured to vaporize, by heat from a cooling target, at least part of the refrigerant having passed through the throttle, and the refrigerant having passed through the throttle being returned to the tank.

Apparatus for recording data and method for making the same. In accordance with some embodiments, a magnetic layer is supported by a substrate and comprises a magnetic magnetic material, a non-magnetic material, and an energy assisted segregation material. The segregation material enhances segregation of the non-magnetic material into grain boundaries within the layer at an elevated, moderate energy level.

According to various embodiments, the temperature control roller may comprise: a cylindrical roller shell, which has a multiplicity of gas outlet openings; a temperature control device, which is configured to supply and/or extract thermal energy to or from the cylindrical roller shell; multiple gas lines made to extend along the axis of rotation; a gas distributing structure, which couples the multiple gas lines and the multiplicity of gas outlet openings to one another in a gas-conducting manner, the gas distributing structure having a lower structure density than the multiplicity of gas outlet openings.

A device for forming coatings on surfaces of a component, band-shaped material, or tool, in which at least one wire-shaped or band-shaped material is used for forming the coating and that is/are connected to a direct electrical current source, wherein an electric arc is formed between wire-shaped materials or between one wire-shaped or band-shaped material and one anode or cathode, wherein wire-shaped or band-shaped material may be fed by means of a feed device; and melted and/or evaporated material of the wire-shaped or band-shaped material flows, by means of a gas jet of a gas or gas mixture, through an inlet into the interior of a chamber that can be heated to a temperature that is at least equal to the evaporation temperature of the at least one material used for the coating or of the material with the highest evaporation temperature, and the material(s) completely evaporates and exits through at least one opening present on the chamber and impinges on the surface to be coated of the component or tool for forming the coating.

This sputtering cathode has a sputtering target having a tubular shape in which the cross-sectional shape thereof has a pair of long side sections facing each other, and an erosion surface facing inward. Using the sputtering target, while moving a body to be film-formed, which has a film formation region having a narrower width than the long side sections of the sputtering target, parallel to one end face of the sputtering target and at a constant speed in a direction perpendicular to the long side sections above a space surrounded by the sputtering target, discharge is performed such that a plasma circulating along the inner surface of the sputtering target is generated, and the inner surface of the long side sections of the sputtering target is sputtered by ions in the plasma generated by a sputtering gas to perform film formation in the film formation region of the body to be film-formed.

A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.