A light-transmitting electroconductive film (20) according to the present invention includes a region containing krypton at a content ratio of less than 0.1 atomic % at least partially in a thickness direction (D) of the light-transmitting electroconductive film (20). A transparent electroconductive film (X) according to the present invention includes a transparent substrate (10); and the light-transmitting electroconductive film (20) disposed on one surface side in the thickness direction (D) of the transparent substrate.

Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide-based substrate having a fluorine layer disposed on at least one side thereof; a tie-layer disposed on the polyimide-based substrate having the fluorine layer placed thereon; and a copper layer disposed on the tie layer, wherein the tie-layer includes at least one metal element selected from among metal elements of Group 4, Group 6, Group 13, and Group 14 in the Periodic Table, and the at least one metal element may have a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more.

The present invention discloses a vacuum coating device, comprising: a crucible, an induction heater provided on the periphery of the crucible, a flow distribution box connected to the top of said crucible via a steam pipe, wherein said steam pipe is provided with a pressure regulating valve, said flow distribution box is provided inside with a horizontal pressure stabilizing plate, said flow distribution box is connected on the top with a nozzle, and a deflector being arranged above said nozzle along the emitting direction of the steam. Wherein a distance Da from nozzle outlet to steel plate is 10˜200 mm, a height Db of said deflector is 10˜199 mm; a distance Dc from top of said deflector to steel plate is 1˜190 mm; an angle Dd between said deflector and said nozzle outlet is 60°˜135°. The vacuum coating device in the present invention can improve the yield of the coating, and also can form a uniform coating with consistent thickness.

A transparent electroconductive layer 3 includes a first main surface 5 and a second main surface 6 facing each other in a thickness direction. The transparent electroconductive layer 3 is a single layer extending in a plane direction perpendicular to the thickness direction. The transparent electroconductive layer 3 has a plurality of crystal grains 4, a plurality of first grain boundaries 7 partitioning the plurality of crystal grains 4 and having each of one end edge 9 and another end edge 10 in the thickness direction open in each of the first main surface 5 and the second main surface 6, and a second grain boundary 8 branching from a first intermediate portion 11 of one first grain boundary 7A and reaching a second intermediate portion 12 of another first grain boundary 7B.

The evaporation source for use in the vacuum evaporation apparatus in vacuum evaporation of a film formation object inside a vacuum chamber has: a main cylindrical body having a crucible part to be filled with an evaporation material Em; a secondary cylindrical body protruded from such a portion of the main cylindrical body as is positioned above the evaporation material; and a heater capable of heating the evaporation material that is filled in the crucible part. The secondary cylindrical body is detachably mountable on the main cylindrical body while shifting a phase of the discharge opening. A lid body is disposed in a manner to open or close an upper-surface opening of the crucible part. In a state in which the upper-surface opening of the crucible part is blocked by the lid body in a vacuum atmosphere, the evaporation material in the crucible part is heated by the heater.

A method of fabricating a superconducting wire includes forming a buffer layer on the substrate, the buffer layer including an Al.sub.2O.sub.3 layer, the Al.sub.2O.sub.3 layer being formed by reactive magnetron sputtering in which first oxygen gas as reactant gas and a sputtering target made of aluminium metal are used, the Al.sub.2O.sub.3 layer being formed while being supplied the first oxygen gas at a first concentration, the first concentration being a concentration of the first oxygen gas at which an emission intensity of Al in plasma near a surface of the sputtering target is not less than 25% and not more than 80% of a first reference value, the first reference value being the emission intensity of Al at which the concentration of the first oxygen gas is zero; and forming a superconducting layer above the buffer layer.

An evaporation boat comprising an evaporator body has an evaporator surface which extends along a longitudinal direction of the evaporator body from a first end face toward a second end face of the evaporator body. The evaporator body comprises at least one recess on an underside (20) opposite to the evaporator surface, so that the evaporator body has a thickness between the evaporator surface and the underside in the region of the at least one recess along its longitudinal direction which decreases from the center of the evaporator body in the longitudinal direction toward one of the end faces associated with the recess. The use of such an evaporation boat is specified as well.

[Problem]

To provide a laminate body in which a resin base member and a metal deposition film are brought into firmly close contact with each other.

[Solution]

The laminate body manufacturing method includes a desorption step S10, an introduction step S20, a deposition step S30, and a coating step S40. In the desorption step S10, a hydrophobic surface of resin is irradiated with plasma to desorb at least some of the atoms constituting the resin from the surface. In the introduction step S20, the surface of the resin subjected to the desorption step S10 is irradiated with hydroxyl radicals to introduce a hydroxyl group onto the surface of the resin. In the deposition step S30, a metal film is deposited on the surface of the resin subjected to the introduction step S20. In the coating step S40, the surface of the metal film is coated with a metal layer formed of the same metal as the metal forming the metal film.

A treatment method performed by a film processing apparatus including: a first discharge electrode unit and a second discharge electrode unit respectively including magnets that form a magnetic field; and an AC power source capable of alternately switching polarities of the first discharge electrode unit and the second discharge electrode unit. In the treatment method, a predetermined surface treatment of a film F is performed by generating a plasma P while alternately switching polarities of the first discharge electrode unit and the second discharge electrode unit by using high-frequency power supplied from the AC power source.

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.