C23C16/36

Process for passivating dielectric films

Methods are disclosed herein for depositing a passivation layer comprising fluorine over a dielectric material that is sensitive to chlorine, bromine, and iodine. The passivation layer can protect the sensitive dielectric layer thereby enabling deposition using precursors comprising chlorine, bromine, and iodine over the passivation layer.

Methods for atomic layer deposition of SiCO(N) using halogenated silylamides

Methods for the formation of films comprising Si, C, O and N are provided. Certain methods involve sequential exposures of a hydroxide terminated substrate surface to a silicon precursor and an alcohol-amine to form a film with hydroxide terminations. Certain methods involved sequential exposures of hydroxide terminated substrate surface to a silicon precursor and a diamine to form a film with an amine terminated surface, followed by sequential exposures to a silicon precursor and a diol to form a film with a hydroxide terminated surface.

Methods for atomic layer deposition of SiCO(N) using halogenated silylamides

Methods for the formation of films comprising Si, C, O and N are provided. Certain methods involve sequential exposures of a hydroxide terminated substrate surface to a silicon precursor and an alcohol-amine to form a film with hydroxide terminations. Certain methods involved sequential exposures of hydroxide terminated substrate surface to a silicon precursor and a diamine to form a film with an amine terminated surface, followed by sequential exposures to a silicon precursor and a diol to form a film with a hydroxide terminated surface.

Coated cutting tool
11548074 · 2023-01-10 · ·

Provided is a coated cutting tool having improved wear resistance and fracture resistance and a prolonged tool life. The coated cutting tool includes a substrate and a coating layer formed on the substrate. The coating layer includes a first layer containing Ti(C.sub.x1N.sub.1-x1) and a second layer containing (Ti.sub.1-y1Al.sub.y1)N, particles in the first layer have an average particle size of 5 nm or more and less than 100 nm, 1.0≤I(111)/I(200)≤20.0 in the first layer, the first layer has an average thickness of 5 nm or more and 1.0 μm or less, 0.1≤I(111)/I(200)≤1.0 in the second layer, particles in the second layer have an average particle size of more than 100 nm and 300 nm or less, and the second layer has an average thickness of 5 nm or more and 2.0 μm or less.

Coated cutting tool
11548074 · 2023-01-10 · ·

Provided is a coated cutting tool having improved wear resistance and fracture resistance and a prolonged tool life. The coated cutting tool includes a substrate and a coating layer formed on the substrate. The coating layer includes a first layer containing Ti(C.sub.x1N.sub.1-x1) and a second layer containing (Ti.sub.1-y1Al.sub.y1)N, particles in the first layer have an average particle size of 5 nm or more and less than 100 nm, 1.0≤I(111)/I(200)≤20.0 in the first layer, the first layer has an average thickness of 5 nm or more and 1.0 μm or less, 0.1≤I(111)/I(200)≤1.0 in the second layer, particles in the second layer have an average particle size of more than 100 nm and 300 nm or less, and the second layer has an average thickness of 5 nm or more and 2.0 μm or less.

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM

A method for forming an oligomer-containing layer on a substrate and in a concave portion formed on the substrate by performing a cycle a predetermined number of times under a first temperature, the cycle including supplying a precursor gas to the substrate, and supplying first and second nitrogen- and hydrogen-containing gases to the substrate, so an oligomer including an element in at least one selected from the group of the precursor gas, and the first and second nitrogen-hydrogen-containing gasses, flowed in the concave portion, and (b) forming a film to fill the inside of the concave portion by post-treating the substrate, which has the oligomer-containing layer formed on the surface of the substrate and in the concave portion, under a second temperature not less than the first temperature, so that the oligomer-containing layer formed in the concave portion is modified to form the film.

Coated tool and cutting tool including same

A coated tool of the present disclosure is provided with a base member and a coating layer located on a surface of the base member. The coating layer includes a TiCNO layer and an Al.sub.2O.sub.3 layer. The Al.sub.2O.sub.3 layer is located in contact with the TiCNO layer at a position farther from the base member than the TiCNO layer is. The TiCNO layer includes a first composite protrusion including a first protrusion that projects toward the Al.sub.2O.sub.3 layer and a second protrusion that projects from the first protrusion in a direction intersecting a direction in which the first protrusion projects. A cutting tool of the present disclosure is provided with: a holder extending from a first end toward a second end and including a pocket on a side of the first end; and the above-described coated tool located in the pocket.

Coated tool and cutting tool including same

A coated tool of the present disclosure is provided with a base member and a coating layer located on a surface of the base member. The coating layer includes a TiCNO layer and an Al.sub.2O.sub.3 layer. The Al.sub.2O.sub.3 layer is located in contact with the TiCNO layer at a position farther from the base member than the TiCNO layer is. The TiCNO layer includes a first composite protrusion including a first protrusion that projects toward the Al.sub.2O.sub.3 layer and a second protrusion that projects from the first protrusion in a direction intersecting a direction in which the first protrusion projects. A cutting tool of the present disclosure is provided with: a holder extending from a first end toward a second end and including a pocket on a side of the first end; and the above-described coated tool located in the pocket.

CUTTING TOOL

A cutting tool includes a substrate and a coated film arranged on the substrate. The coated film includes a first layer. The first layer includes a plurality of crystal grains. The crystal grains are composed of Al.sub.xTi.sub.1−xC.sub.yN.sub.1−y, wherein x is more than 0.65 and less than 0.95, and y is not less than 0 and less than 0.1. In a first region, the crystal grains have an average aspect ratio of not more than 3.0. In a second region, the crystal grains have an average aspect ratio of more than 3.0 and not more than 10.0. The crystal grains include crystal grains having a cubic crystal structure. The first layer has a ratio of an area occupied by the crystal grains having a cubic crystal structure of not less than 90%. The first layer has a thickness of not less than 2 m and not more than 20 m.

CUTTING TOOL

A cutting tool includes a substrate and a coated film arranged on the substrate. The coated film includes a first layer. The first layer includes a plurality of crystal grains. The crystal grains are composed of Al.sub.xTi.sub.1−xC.sub.yN.sub.1−y, wherein x is more than 0.65 and less than 0.95, and y is not less than 0 and less than 0.1. In a first region, the crystal grains have an average aspect ratio of not more than 3.0. In a second region, the crystal grains have an average aspect ratio of more than 3.0 and not more than 10.0. The crystal grains include crystal grains having a cubic crystal structure. The first layer has a ratio of an area occupied by the crystal grains having a cubic crystal structure of not less than 90%. The first layer has a thickness of not less than 2 m and not more than 20 m.