Patent classifications
C23C16/38
DOWNHOLE SAND CONTROL SCREEN SYSTEM
System and method of non-line-of-sight coating of a sand screen for use in wellbores during the production of hydrocarbon fluids from subterranean formations. The coatings can have uniformly coated internal and external surfaces.
DOWNHOLE SAND CONTROL SCREEN SYSTEM
System and method of non-line-of-sight coating of a sand screen for use in wellbores during the production of hydrocarbon fluids from subterranean formations. The coatings can have uniformly coated internal and external surfaces.
MATERIAL DEPOSITION SYSTEMS, AND RELATED METHODS AND MICROELECTRONIC DEVICES
A material deposition system comprises a precursor source and a chemical vapor deposition apparatus in selective fluid communication with the precursor source. The precursor source configured to contain at least one metal-containing precursor material in one or more of a liquid state and a solid state. The chemical vapor deposition apparatus comprises a housing structure, a distribution manifold, and a substrate holder. The housing structure is configured and positioned to receive at least one feed fluid stream comprising the at least one metal-containing precursor material. The distribution manifold is within the housing structure and is in electrical communication with a signal generator. The substrate holder is within the housing structure, is spaced apart from the distribution assembly, and is in electrical communication with an additional signal generator. A microelectronic device and methods of forming a microelectronic device also described.
MATERIAL DEPOSITION SYSTEMS, AND RELATED METHODS AND MICROELECTRONIC DEVICES
A material deposition system comprises a precursor source and a chemical vapor deposition apparatus in selective fluid communication with the precursor source. The precursor source configured to contain at least one metal-containing precursor material in one or more of a liquid state and a solid state. The chemical vapor deposition apparatus comprises a housing structure, a distribution manifold, and a substrate holder. The housing structure is configured and positioned to receive at least one feed fluid stream comprising the at least one metal-containing precursor material. The distribution manifold is within the housing structure and is in electrical communication with a signal generator. The substrate holder is within the housing structure, is spaced apart from the distribution assembly, and is in electrical communication with an additional signal generator. A microelectronic device and methods of forming a microelectronic device also described.
METHOD OF FORMING STRUCTURES FOR THRESHOLD VOLTAGE CONTROL
Methods and systems for depositing threshold voltage shifting layers onto a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process, depositing a threshold voltage shifting layer onto a surface of the substrate.
Methods of coating a sand screen component
A method of non-line-of-sight coating of a sand screen for use in wellbores during the production of hydrocarbon fluids from subterranean formations. The coating can have uniformly coated internal and external surfaces.
Methods of coating a sand screen component
A method of non-line-of-sight coating of a sand screen for use in wellbores during the production of hydrocarbon fluids from subterranean formations. The coating can have uniformly coated internal and external surfaces.
METHODS AND SYSTEMS FOR ATOMIC LAYER ETCHING AND ATOMIC LAYER DEPOSITION
A method for etching a surface including obtaining a structure comprising a plurality of nanowires on or above a substrate and a dielectric layer on or above the nanowires, wherein the dielectric layer comprises protrusions formed by the underlying nanowires; reacting a surface of the dielectric layer with a reactant, comprising a gas or a plasma, to form a reactive layer on the dielectric layer, wherein the reactive layer comprises a chemical compound including the reactant and elements of the dielectric layer and the reactive layer comprises sidewalls defined by the protrusions; and selectively etching the reactive layer, wherein the etching etches the protrusions laterally through the sidewalls so as to planarize the surface and remove or shrink the protrusions.
Methods for low-temperature p-CVD and thermal ALD of magnesium diboride
ALD and p-CVD methods to generate MgB.sub.2 and MgB.sub.2-containing films in the growth temperature range of 250-300° C. The thermal ALD and p-CVD methods shown herein ensure that the high-temperature-induced roughening, which causes high surface resistances in MgB.sub.2 coatings grown by the mentioned conventional techniques, is avoided. The MgB.sub.2 and MgB.sub.2-containing films exhibit superconductive properties at above 20° K.
Methods for low-temperature p-CVD and thermal ALD of magnesium diboride
ALD and p-CVD methods to generate MgB.sub.2 and MgB.sub.2-containing films in the growth temperature range of 250-300° C. The thermal ALD and p-CVD methods shown herein ensure that the high-temperature-induced roughening, which causes high surface resistances in MgB.sub.2 coatings grown by the mentioned conventional techniques, is avoided. The MgB.sub.2 and MgB.sub.2-containing films exhibit superconductive properties at above 20° K.