A deposition apparatus for depositing a material on a substrate is provided. The deposition apparatus has a processing chamber defining a processing space in which the substrate is arranged, an ultraviolet radiation assembly configured to emit ultraviolet radiation and a microwave radiation assembly configured to emit microwave radiation into an excitation space that can be the same as the processing space, and a gas feed assembly configured to feed a precursor gas into the processing space and a reactive gas into the excitation space. The ultraviolet radiation assembly and the microwave radiation assembly are operated in combination to excite the reactive gas in the excitation space. The material is deposited on the substrate from the reaction of the excited reactive gas and the precursor gas. A method for using the deposition apparatus to deposit a material on a substrate is provided.

A method for coating temperature-sensitive substrates with polycrystalline diamond by a hot-wire CVD method, in which hydrogen and at least one carbon carrier gas are fed into a coating chamber. The fed gases are split at an electrically heated wire in such a way that carbon is formed and deposits on the temperature-sensitive substrate in the form of the diamond modification thereof. The substrate is arranged in the coating chamber, which is at a reduced pressure, and electrical power to electrically heat the wire is adjustable. The method is performed cyclically in respect of the electrical power that is fed to electrically heat the wire. A basic power is fed as lower threshold value for a predetermined time (basic load phase) and is increased for a further predetermined time to a maximum power as an upper threshold value (pulse phase) and is then reduced again to the basic power.

A method for coating temperature-sensitive substrates with polycrystalline diamond by a hot-wire CVD method, in which hydrogen and at least one carbon carrier gas are fed into a coating chamber. The fed gases are split at an electrically heated wire in such a way that carbon is formed and deposits on the temperature-sensitive substrate in the form of the diamond modification thereof. The substrate is arranged in the coating chamber, which is at a reduced pressure, and electrical power to electrically heat the wire is adjustable. The method is performed cyclically in respect of the electrical power that is fed to electrically heat the wire. A basic power is fed as lower threshold value for a predetermined time (basic load phase) and is increased for a further predetermined time to a maximum power as an upper threshold value (pulse phase) and is then reduced again to the basic power.

There is provided a plasma processing apparatus comprising: a chamber; a gas supply configured to supply a processing gas into the chamber; an exhaust device configured to exhaust a gas within the chamber; a substrate support including a lower electrode electrically floating from a ground potential and provided within the chamber; an upper electrode provided above the substrate support; a power supply electrically connected to the upper electrode and configured to generate high frequency power or to periodically generate pulses of DC voltage; and a ring electrode provided around the substrate support so as to surround the substrate support and connected to ground.

There is provided a plasma processing apparatus comprising: a chamber; a gas supply configured to supply a processing gas into the chamber; an exhaust device configured to exhaust a gas within the chamber; a substrate support including a lower electrode electrically floating from a ground potential and provided within the chamber; an upper electrode provided above the substrate support; a power supply electrically connected to the upper electrode and configured to generate high frequency power or to periodically generate pulses of DC voltage; and a ring electrode provided around the substrate support so as to surround the substrate support and connected to ground.

Provided is an apparatus and a method for coating objects and in particular containers with at least one first and one second coating station, wherein these coating stations each have at least one first coating electrode and one second coating electrode, and with a supply device for electrical supply of in each case at least one of the coating electrodes. The supply device has a high-frequency generator device for generating an a.c. voltage and/or voltage pulses as well as an a.c. voltage distribution device which distributes this a.c. voltage and/or the voltage pulses respectively to in each case at least one electrode of the first coating station and at least one electrode of the second coating station, wherein the a.c. voltage distribution device is suitable and intended for distributing the a.c. voltages and/or the voltage pulses with a time delay to the electrodes.

Methods and systems for manufacturing a structure comprising a substrate. The substrate comprises plurality of recesses and a plurality of lateral spaces. The recesses and lateral spaces are at least partially filled with a gap filling fluid.

Methods for producing halosilazane comprise halogenating a hydrosilazane with a halogenating agent to produce the halosilazane, the halosilazane having a formula
(SiH.sub.a(NR.sub.2).sub.bX.sub.c).sub.(n+2)N.sub.n(SiH.sub.(2−d)X.sub.d).sub.(n−1),
wherein each a, b, c is independently 0 to 3; a+b+c=3; d is 0 to 2 and n≥1; wherein X is selected from a halogen atom selected from F, Cl, Br or I; each R is selected from H, a C.sub.1-C.sub.6 linear or branched, saturated or unsaturated hydrocarbyl group, or a silyl group [SiR′.sub.3]; further wherein each R′ of the [SiR′.sub.3] is independently selected from H, a halogen atom selected from F, Cl, Br or I, a C.sub.1-C.sub.4 saturated or unsaturated hydrocarbyl group, a C.sub.1-C.sub.4 saturated or unsaturated alkoxy group, or an amino group [—NR.sup.1R.sup.2] with each R.sup.1 and R.sup.2 being further selected from H or a C.sub.1-C.sub.6 linear or branched, saturated or unsaturated hydrocarbyl group, provided that when c=0, d≠0; or d=0, c≠0.

Methods for producing halosilazane comprise halogenating a hydrosilazane with a halogenating agent to produce the halosilazane, the halosilazane having a formula
(SiH.sub.a(NR.sub.2).sub.bX.sub.c).sub.(n+2)N.sub.n(SiH.sub.(2−d)X.sub.d).sub.(n−1),
wherein each a, b, c is independently 0 to 3; a+b+c=3; d is 0 to 2 and n≥1; wherein X is selected from a halogen atom selected from F, Cl, Br or I; each R is selected from H, a C.sub.1-C.sub.6 linear or branched, saturated or unsaturated hydrocarbyl group, or a silyl group [SiR′.sub.3]; further wherein each R′ of the [SiR′.sub.3] is independently selected from H, a halogen atom selected from F, Cl, Br or I, a C.sub.1-C.sub.4 saturated or unsaturated hydrocarbyl group, a C.sub.1-C.sub.4 saturated or unsaturated alkoxy group, or an amino group [—NR.sup.1R.sup.2] with each R.sup.1 and R.sup.2 being further selected from H or a C.sub.1-C.sub.6 linear or branched, saturated or unsaturated hydrocarbyl group, provided that when c=0, d≠0; or d=0, c≠0.

Exemplary methods of semiconductor processing may include flowing a silicon-containing precursor into a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region, and the substrate may be maintained at a temperature below or about 450° C. The methods may include striking a plasma of the silicon-containing precursor. The methods may include forming a layer of amorphous silicon on a semiconductor substrate. The layer of amorphous silicon may be characterized by less than or about 3% hydrogen incorporation.