A problem exists of prohibitively high costs associated with molds for small run, legacy, or prototype injection molded parts. Further, the lead time on molds is currently on the order of about two weeks. A mold is provided that is formed from three-dimensional printing. The mold includes a series of air and/or water cooling channels to limit thermal stresses to the mold. Additionally, a series of coatings is added to the surface of a 3D printed mold to extend the lifetime of the mold and increase the performance of the mold. The coatings perform a function other than to define a shape of an injection cavity, such as improving thermal conductivity, providing a thermal barrier between the injection material and the mold body, or improving the detachment of the final mold product from the mold body.

Methods of enhancing the corrosion resistance of an oxidizable material exposed to a supercritical fluid is disclosed One method includes placing a surface layer on an oxidizable material, and choosing a buffered supercritical fluid containing a reducing agent with the composition of the buffered supercritical fluid containing the reducing agent chosen to avoid the corrosion of the surface layer or reduce the rate of corrosion of the surface layer and avoid the corrosion of the oxidizable material or reduce the rate of corrosion of the oxidizable material at a temperature above the supercritical temperature and supercritical pressure of the supercritical fluid.

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 ?m, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.

A method for forming a self-forming barrier in a feature of a substrate is provided, including the following operations: depositing a metallic liner in the feature of the substrate, the metallic liner being deposited over a dielectric of the substrate; depositing a zinc-containing precursor over the metallic liner; performing a thermal soak of the substrate; repeating the depositing of the zinc-containing precursor and the thermal soak of the substrate for a predefined number of cycles; wherein the method forms a zinc-containing barrier layer at an interface between the metallic liner and the dielectric.

A metal wiring layer can be formed within a recess of a substrate and an unnecessary plating layer is not left on a surface of the substrate. A metal wiring layer forming method includes forming a first plating layer 7 as a protection layer at least on a tungsten or tungsten alloy 4 formed on a bottom surface 3a of a recess 3 of a substrate 2; removing an unnecessary plating layer 7a formed on a surface 2a of the substrate 2; and forming a second plating layer 8 on the first plating layer 7 within the recess 3.

A gas sensor has a microstructure sensing element which comprises a plurality of interconnected units wherein the units are formed of connected graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.

A method for producing patterned metallic coatings includes an initiator composition having at least one active substance being added to a substrate. A precursor composition including at least one precursor compound for a metallic layer is applied to the initiator composition coating. A metallic layer is then deposited by the active substance. At least one composition is applied as an emulsion in order to obtain a patterning of the resultant metallic layer.

A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

A substrate processing method using a supercritical fluid is provided that can deposit a conformal film in a trench with a high aspect ratio and allows complete filling without voids. The substrate processing method comprises supplying a first process fluid containing a precursor and a first supercritical fluid to a reactor to raise a pressure of the reactor to a first pressure equal to or greater than a critical pressure, subsequently, first venting the reactor to lower the pressure in the reactor to a second pressure, subsequently, supplying a second process fluid containing a reducing fluid to the reactor to raise the pressure in the reactor to a third pressure, subsequently, second venting the reactor to lower the pressure in the reactor to a fourth pressure.

A catalyst is imparted selectively to a plateable material portion 32 by performing a catalyst imparting processing on a substrate W having a non-plateable material portion 31 and the plateable material portion 32 formed on a surface thereof. Then, a hard mask layer 35 is formed selectively on the plateable material portion 32 by performing a plating processing on the substrate W. The non-plateable material portion 31 is made of SiO.sub.2 as a main component, and the plateable material portion 32 is made of a material including, as a main component, a material containing at least one of a OCH.sub.x group and a NH.sub.x group, a metal material containing Si as a main component, a material containing carbon as a main component or a catalyst metal material.