Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H.sub.2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions each usable to both make up an original bath and to replenishment of the original bath.

The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions or concentrates each usable to both make up an original bath and to replenishment of the original bath.

The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions each usable to both make up an original bath and to replenishment of the original bath.

An aqueous alkaline deposition composition for the electroless deposition or metal or metal alloy on a metal surface, the composition comprising: (a) functionalized urea derivatives and/or salts thereof selected from the group comprising compounds having formula I and/or salts thereof:

##STR00001## wherein X is selected as oxygen; R.sup.1 and R.sup.2 are independently selected as nitrogen-comprising heteroaromatic compounds; wherein R.sup.1 and R.sup.2 can be identical or different; m is an integer from 1 to 6; and n is an integer from 1 to 6; wherein m and n can be identical or different; (b) one source of metal ions to be deposited onto the metal surface of the substrate wherein the deposited metal or metal alloy is different from the metal or metal alloy of the metal surface; and (c) optionally one source of alloying metal ions; and a method for the electroless deposition.

One or more aspects of this invention pertain to fabrication of electronic devices. One aspect of the present invention is a system for electroless deposition of metal on a substrate. According to one or more embodiments of the present invention, the system comprises a main subsystem in combination with one or more subsystems for electroless deposition on a substrate. Another aspect of the present invention is a method of making an electronic device. According to one or more embodiments of the present invention, the method comprises one or more processes. Descriptions according to one or more embodiments of the system and the processes are presented.

A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method.

A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.

One or more aspects of this invention pertain to fabrication of electronic devices. One aspect of the present invention is a system for electroless deposition of metal on a substrate. According to one or more embodiments of the present invention, the system comprises a main subsystem in combination with one or more subsystems for electroless deposition on a substrate. Another aspect of the present invention is a method of making an electronic device. According to one or more embodiments of the present invention, the method comprises one or more processes. Descriptions according to one or more embodiments of the system and the processes are presented.

A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method. A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.

A roll-to-roll electroless plating system, including a plating tank containing plating solution, and a web advance system for advancing a web of media along a web-transport path that passes through the plating tank. One or more fluid guides are positioned within the plating tank to redirect plating fluid containing gas bubbles introduced by a gas bubble source away from the web of media as it is advanced through the plating solution in the plating tank.