Systems and methods for nickel plating include providing a tank that retains a plating bath into which a substrate is submerged, and creating a horizontal flow of processing solution in the plating bath to assist in carrying contaminants out of the plating bath. A sparger box may be positioned in the tank to deliver the processing solution into the plating bath in a horizontal direction. The processing solution, which carries the contaminants, may exit the plating bath through a plate member that includes a plurality of orifices and is also positioned in the tank. The orifices may have a variable opening size to help control outflow of the processing solution.

Provided is a surface-metalized polymer film comprising: (a) a polymer film having a thickness from 10 nm to 5 mm and two primary surfaces; (b) a graphene layer having a thickness from 0.34 nm to 50 m and comprising multiple graphene sheets and an optional conducive filler coated on or bonded to at least one of the two primary surfaces with or without using an adhesive resin; and (c) a metal layer comprising a plated metal deposited on the graphene layer; wherein the graphene sheets contain single-layer or few-layer graphene sheets selected from a pristine graphene, graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof. This film exhibits a high scratch resistance, strength, hardness, electrical conductivity, thermal conductivity, light reflectivity, gloss, etc.

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. The plating liquid M1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.

A method of initiating and controlling electroless nickel plating on copper substrates carried into a plating bath on a continuous stainless steel web where the copper is electrically bussed or in physical contact with the steel is described. A bias current is applied to the plating bath and a feedback loop is established to determine initiation of plating as well as to ramp down the biasing current to prevent electro- or electroless plating of the web.

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is imparted selectively to the plateable material portion 32 by supplying a catalyst solution N1 onto the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. A pH of the catalyst solution N1 is previously adjusted such that the plating layer 35 is suppressed from being precipitated on the non-plateable material portion 31 while being facilitated to be precipitated on the plateable material portion 32.

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by performing a plating processing on the substrate W. Before the imparting of the catalyst, an organic film 36 is formed on the substrate W by supplying an organic liquid L1 onto the substrate W.

A method for manufacturing an electrode, which can suppress waste of electrode substrate, prevent impairment of operability, improve flatness and the like, and reliably prevent falling off thereof, and simultaneously can prevent wrinkles and bulges of the electrode caused by the heat treatment and the like, thereby manufacturing a higher-quality electrode. The method includes: preparing a rectangular plate-like electrode substrate having attachment portions at two ends including opposing sides by linearly bending two parts so that each part has an overall even side; holding the attachment portions by the suspension jig and a lower jig each being provided with a movement restriction portion with which a leading end of each attachment portion comes into contact, thereby maintaining the electrode substrate in a suspended state; and performing at least heat treatment on the suspended electrode substrate so as to manufacture a portion for an electrode.

A printed electrical device is formed using a flexographic printing system. A flexographic printing plate having a pattern of raised features includes an active region having a plurality of parallel traces separated by a trace spacing of between 5-40 microns that are used to form active micro-traces that provide an electrical function, and an inactive region adjacent to the active region having one or more protective features that are used to form electrically-inactive features. The protective features are separated from an outermost trace of the plurality of traces by a gap distance of between 60% and 250% of the trace spacing. The flexographic printing plate is used to transfer ink from an anilox roller to a substrate to provide a printed pattern corresponding to the pattern of raised features on the flexographic printing plate.

Methods for manufacturing electrically-conductive proppant particles are disclosed. The methods can include preparing a slurry containing water, a binder, and a raw material having an alumina content, atomizing the slurry into droplets, and coating seeds containing alumina with the droplets to form a plurality of green pellets. The green pellets can be contacted with an activation solution containing at least one catalytically active material to provide activated green pellets including the at least one catalytically active material. The method can include sintering the activated green pellets to provide a plurality of proppant particles. The plurality of proppant particles can be contacted with a plating solution containing one or more electrically-conductive material to provide electrically-conductive proppant particles.

A catalyst is imparted selectively to a plateable material portion 32 by performing a catalyst imparting processing on a substrate W having a non-plateable material portion 31 and the plateable material portion 32 formed on a surface thereof. Then, a hard mask layer 35 is formed selectively on the plateable material portion 32 by performing a plating processing on the substrate W. The non-plateable material portion 31 is made of SiO.sub.2 as a main component, and the plateable material portion 32 is made of a material including, as a main component, a material containing at least one of a OCH.sub.x group and a NH.sub.x group, a metal material containing Si as a main component, a material containing carbon as a main component or a catalyst metal material.