A composite thermal barrier coating (TBC) may be applied to a surface of components within an internal combustion engine. The composite TBC provides low thermal conductivity and low heat capacity insulation that is sealed against combustion gasses. The composite TBC includes three layers, bonded to one another, i.e., a first (bonding) layer, a second (insulating) layer, and a third (sealing) layer. The insulating layer is disposed between the bonding layer and the sealing layer. The bonding layer is bonded to the component and to the insulating layer. The insulating layer includes hollow microspheres that are sintered together to form insulation that provides a low effective thermal conductivity and low effective heat capacity. The sealing layer is a thin film that is configured to resist the high temperatures, present within the engine. The sealing layer is impermeable to gasses and presents a smooth surface.

Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

A chemically amplified positive-type photosensitive resin composition capable of suppressing occurrence of footing in which the width of the bottom becomes narrower than that of the top in a nonresist section, denaturation of the surface of the metal substrate, and occurrence of a development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of the substrate having the metal surface by using the composition; a method for manufacturing a substrate with a template by using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the chemically resin composition which includes an acid generator, and a resin whose solubility in alkali increases under the action of acid.

The present invention relates to the lead-zirconate-titanate (PZT) amorphous alloy plating solution which may be used to form a PZT amorphous alloy film having excellent mechanical and physical properties and a method for plating a PZT amorphous alloy using the same. The PZT amorphous alloy plating solution may include a Pb precursor, a Zr precursor, and a Ti precursor. 10˜50 parts by weight of the Zr precursor and 5˜30 parts by weight of the Ti precursor may be included based on 100 parts by weight of the Pb precursor. Accordingly, electrical conductivity can be improved because the PZT amorphous alloy plating solution has a structure which has low crystallinity or which is amorphous. Furthermore, excellent electrical characteristics can be achieved because the PZT amorphous alloy plating solution has excellent conductivity or chemical stability.

A system for electroless deposition on a substrate is provided, including the following: a chamber; a substrate support configured to receive a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region and a process region, wherein the substrate support is configured to rotate the substrate; a solution container configured to hold an electroless deposition solution; a dispenser configured to provide a flow of the electroless deposition solution; a controller, the controller configured to direct the flow of the electroless deposition solution toward the edge exclusion region while the substrate is rotated, the flow being directed away from the process region, the electroless deposition solution plates metallic material over the conductive layer at the edge exclusion region, to produce an increased thickness of the metallic material that reduces electrical resistance.

A catalyst layer can be uniformly formed on an entire surface of a substrate and an entire inner surface of a recess. A catalyst layer forming method of forming the catalyst layer on the substrate includes a first supply processing of forming a substrate surface catalyst layer 22A by supplying a catalyst liquid on the entire surface of the substrate 2; and a second supply processing of forming a recess inner surface catalyst layer 22B by supplying the catalyst liquid to a central portion of the substrate 2 while rotating the substrate 2.

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.

A black plated resin part includes a resin substrate, an underlying plating layer formed on the resin substrate, and a black chromium plating layer formed of trivalent chromium and having a thickness of 0.15 μm or more. The black chromium plating layer is formed on the underlying plating layer. The chromium in the black chromium plating layer is present in the form of metallic chromium, chromium oxide, and chromium hydroxide, and the black chromium plating layer exhibits a b* value of 3.0 or less based on the L*a*b* color system.

A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.

An apparatus is provided. The apparatus may include one or more of a container, a first magnet assembly, and a second magnet assembly. The container includes an open top and is configured to hold a liquid chemical solution. The first magnet assembly includes a first magnet having a first polarity and a cover, coupled to the first magnet. The cover is configured to be movable between an open and a closed position and limit evaporation of the solution when the cover is in the closed position. The second magnet assembly includes a second magnet having a second polarity. In response to a command, the second magnet assembly is configured to move the cover to the open position without direct contact to the first magnet assembly in response to a command.