A chemically amplified positive-type photosensitive resin composition capable of suppressing occurrence of footing in which the width of the bottom becomes narrower than that of the top in a nonresist section, denaturation of the surface of the metal substrate, and occurrence of a development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of the substrate having the metal surface by using the composition; a method for manufacturing a substrate with a template by using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the chemically resin composition which includes an acid generator, and a resin whose solubility in alkali increases under the action of acid.

Strands of material may be intertwined using weaving techniques, knitting techniques, non-woven or entanglement techniques, or braiding techniques. Fabric that is formed from the strands of material may be used in forming a fabric-based item. The fabric based item may include electrical components. The strands may include conductive strands that form signal paths. The signal paths can carry electrical signals associated with operation of the electrical components. Each strand may have an elongated core and a coating. Strands may also include intermediate layers between the cores and coatings. The cores, intermediate layers, and coatings may be formed from polymer without conductive filler, polymer with conductive filler, and/or metal. A polymer core may be provided with recesses to help retain subsequently deposited layers such as a metal coating layer. The recesses may be grooves that extend along the longitudinal axis of the core.

A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.

Strands of material may be intertwined using weaving techniques, knitting techniques, non-woven or entanglement techniques, or braiding techniques. Fabric that is formed from the strands of material may be used in forming a fabric-based item. The fabric based item may include electrical components. The strands may include conductive strands that form signal paths. The signal paths can carry electrical signals associated with operation of the electrical components. Each strand may have an elongated core and a coating. Strands may also include intermediate layers between the cores and coatings. The cores, intermediate layers, and coatings may be formed from polymer without conductive filler, polymer with conductive filler, and/or metal. A polymer core may be provided with recesses to help retain subsequently deposited layers such as a metal coating layer. The recesses may be grooves that extend along the longitudinal axis of the core.

A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

Strands of material may be intertwined using weaving techniques, knitting techniques, non-woven or entanglement techniques, or braiding techniques. Fabric that is formed from the strands of material may be used in forming a fabric-based item. The fabric based item may include electrical components. The strands may include conductive strands that form signal paths. The signal paths can carry electrical signals associated with operation of the electrical components. Each strand may have an elongated core and a coating. Strands may also include intermediate layers between the cores and coatings. The cores, intermediate layers, and coatings may be formed from polymer without conductive filler, polymer with conductive filler, and/or metal. A polymer core may be provided with recesses to help retain subsequently deposited layers such as a metal coating layer. The recesses may be grooves that extend along the longitudinal axis of the core.

A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.

A method can include coating a first surface of an additively manufactured article made of a base material with a coating material comprising at least two constituents, wherein a first constituent of the at least two constituents is configured to be at least partially transient liquid phase (TLP) diffused from the coating material into the base material at a first constituent diffusion temperature, and a second constituent of the at least two constituents is configured to not diffuse from the coating material at the first constituent diffusion temperature, heating the additively manufactured article to the first constituent diffusion temperature, TLP diffusing at least a portion of the first constituent from the coating and into the base material, leaving the second constituent of the coating material on the first surface, and forming a second surface that is smoother than the first surface.

A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.