A plating method can improve uniformity in a thickness of a plating layer formed on an inner surface of a recess. The plating method includes a loading process of loading the substrate in which the recess is formed into a casing; and a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess. The plating process includes a first plating process of supplying a first plating liquid to the substrate and forming a first plating layer; and a second plating process of supplying a second plating liquid to the substrate and forming a second plating layer on the first plating layer after the first plating process. Further, a concentration of an additive contained in the first plating liquid is different from a concentration of an additive contained in the second plating liquid.

An apparatus including a circuit substrate including a contact in a metal layer; and a transducer including a first electrode deposited on and coupled to a sidewall of the contact and a second electrode coupled to a conductor through which voltage can be applied, wherein the second electrode includes a profile aligned to the sidewall of the contact and separated from the first electrode by a gap. A method including forming a transducer adjacent a contact in a metal layer on a substrate, the transducer including a first electrode disposed on a sidewall of the contact and a second electrode coupled to a conductor through which voltage can be applied, wherein the second electrode includes a profile aligned to the sidewall of the contact and separated from the first electrode by a gap.

A method of modifying a sample surface layer in the vacuum chamber of a particle-optical apparatus, the method performed in vacuum, the method comprising: Providing the microscopic sample attached to a manipulator, Providing a first liquid at a first (controlled) temperature, Dipping the sample in the first liquid, thereby causing a sample surface modification, Removing the sample from the first liquid, Providing a second liquid at a second (controlled) temperature, Dipping the sample in the second liquid, and Removing the sample from the second liquid. This enables the wet processing of a sample in-situ, thereby enhancing speed and/or avoiding subsequent alteration/contamination of the sample, such as oxidation, etc. The method is particularly useful for etching a lamella after machining the lamella with a (gallium) FIB to remove the surface layer where gallium implantation occurred, or where the crystal lattice is disturbed.

A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or -methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.

There is provided a palladium plate coated material (100) comprising: a base material (10); an underlying alloy layer (20) formed on the base material (10); and a palladium plated layer (30) formed on the underlying alloy layer (20). The palladium plate coated material (100) is characterized in that the underlying alloy layer (20) is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).

A black plated resin part includes a resin base material, an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material, a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 0.15 m, and a corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm. A brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system.

A composite structural component is disclosed. The composite structural component can include a lattice structure, a casing disposed about at least a portion of the lattice structure, and a skin adhered to a surface of the casing. The lattice structure and the casing can be formed of a polymeric material and the skin can be formed of a metallic material. A method of manufacturing a composite structural component is disclosed. The method can include creating a casing of a polymeric material and creating a lattice structure of a polymeric material disposed about at least a portion of the casing. The method can include sealing the porosity of the casing and lattice structure. The method can include adhering a skin of a metallic material to at least a portion of the casing. At least one of creating a lattice structure and creating a casing comprises utilizing an additive manufacturing process.

An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.

The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.

A substrate having at least one device; wherein the substrate having a conductive layer disposed on a top surface of the substrate, the top surface having an edge exclusion region defined as an annular area that extends to an edge of the substrate, the top surface of the substrate further having a process region defined as a central area of the substrate that extends to about the annular area; wherein the substrate having a metallic material deposited over the conductive layer at the edge exclusion region, wherein a thickness of the metallic material reduces electrical resistance of the metallic material at the edge exclusion region; wherein the thickness of the metallic material and resulting reduced electrical resistance for an applied electrical current to the metallic material facilitates increasing a rate at which the process region is plated as a result of the applied electrical current and an applied electroplating solution.