A method to produce a flexible substrate is described. A base film material of cyclo-olefin polymer (COP) is provided. A surface of the COP base film is irradiated with UV light to form a functional group on the COP surface. Thereafter, the surface is treated with an alkaline degreaser. Thereafter, a Ni—P seed layer is electrolessly plated on the surface. A photoresist pattern is formed on the Ni—P seed layer. Copper traces are plated within the photoresist pattern. The photoresist pattern is removed and the Ni—P seed layer not covered by the copper traces is etched away to complete the flexible substrate. Alternatively, a biocompatible flexible substrate is formed using a Ni—P seed layer with a biocompatible surface finishing instead of copper.

Electrically-conductive silver metal is provided in a pattern on a substrate having a first supporting side and a second opposing supporting side. One or both of the first supporting side and the second opposing supporting side has one or more electrically-conductive silver metal containing patterns containing the electrically-conductive silver metal; an α-oxy carboxylate; a 5- or 6-membered N-heteroaromatic compound; and a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. Such articles can be used in various devices and electrodes.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

There is provided a method for treating a surface comprising heating the object and the object with a solution comprising a thermal initiator and a polymerizable molecule, wherein the polymerizable molecule reacts with the surface and forms a covalent bond and optionally a covalently bound polymer on the surface of the object. Metal ions are bound to the surface to make the surface possible for adding further metal later. Advantages include that complicated geometries can be coated, problems with oxygen inhibition of the initiator is reduced, and surface reaction to form covalent bonds is promoted compared to the bulk polymerization reaction.

[Object]

To provide a copper clad laminate that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.

[Solving Means]

A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 μΩ.Math.cm or lower.

A floating metallized element assembly and method of manufacturing thereof are disclosed. The floating metallized element assembly includes a work piece of a plateable resin and a non-plateable resin including a front side and a back side. The work piece includes at least one plated decorative region on the plateable resin at the front side. The work piece also includes at least one network of the plateable resin at the back side. The work piece additionally includes a plurality of discrete current paths of the plateable resin extending from the at least one network to the at least one plated decorative region. The work piece also includes at least one non-plated decorative region of the non-plateable resin adjacent the at least one decorative region. Metal surfaces are adhered to and disposed on the at least one plated decorative region.

The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.

The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.

The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.

A laminate comprising a substrate; an adhesive layer formed on at least one surface of both surfaces of the substrate so as to be in direct contact with the substrate; and a plating layer formed on a surface of the adhesive layer opposite to the substrate, wherein the adhesive layer comprises a plating catalyst containing a precious metal, and a silane coupling agent.