An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.

A terminal component disclosed herein includes a first metal and a second metal stacked on the first metal. On the first metal, nickel is plated at least on a boundary surface with the second metal. A joining portion joined by diffusion of the metals is formed in a portion of a boundary between the first metal and the second metal.

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

This technical disclosure describes a device that includes a recital pod and the method of making and maintaining the pod. The device includes a pod that includes a cover including a cover body; a baseplate including a baseplate body; and one or more mating surfaces formed on one or both of the baseplate body and the cover body to assemble between the cover and the baseplate to each other. The one or more mating surfaces each includes an outermost coating configured to be wear-resistant and lubricating, the outermost coating includes a composite metal plating, and the composite metal plating includes a metal plating with a lubricant embedded therein and/or layered over the metal plating.

This technical disclosure describes a device that includes a recital pod and the method of making and maintaining the pod. The device includes a pod that includes a cover including a cover body; a baseplate including a baseplate body; and one or more mating surfaces formed on one or both of the baseplate body and the cover body to assemble between the cover and the baseplate to each other. The one or more mating surfaces each includes an outermost coating configured to be wear-resistant and lubricating, the outermost coating includes a composite metal plating, and the composite metal plating includes a metal plating with a lubricant embedded therein and/or layered over the metal plating.

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

A method of removing a plurality of portions of a black layer of an electrical conduit for a photovoltaic cell is disclosed. The method includes providing a mandrel having the electrical conduit electroformed in the mandrel. The electrical conduit is formed in a preformed pattern on an outer surface of the mandrel. The electrical conduit has the black layer with a black layer thickness on a side opposite of the outer surface of the mandrel. A beam of a laser is controlled toward the black layer of the electrical conduit. The beam is characterized by laser parameters. The beam of the laser removes the plurality of portions of the black layer on the electrical conduit. Each removed portion of the plurality of portions of the black layer has a thickness equal to the black layer thickness, and a portion area of 5 mm.sup.2 to 20 mm.sup.2.

A system for jetting metal is also disclosed, which includes a nozzle orifice in connection with the inner cavity and configured to eject one or more droplets of liquid metal, a source of printing material located external to the ejector, and an alloying system located between the source of printing material and the ejector. A method for metal jetting is disclosed, which includes introducing a printing material from a feed source into an alloying system. The method for metal jetting also includes depositing an alloying material within the alloying system onto the printing material to produce an alloyed printing material, introducing the alloyed printing material into an ejector defining a cavity which can retain a printing material, melting the alloyed printing material in the cavity of the ejector, ejecting the alloyed printing material from the ejector.

The present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise forming a structure using a flowable first material, adapted to form a glass, which includes a metal component. The structure is then treated to remove substantially all solvents and organic components contained in the first flowable material. Finally, the structure is exposed to a bath of a metal salt during which nucleation occurs and a metallized surface coating is formed on at least a portion of an outer surface of the structure.