A method of manufacturing metal matrix composite (MMC) parts, including the steps of applying a metallic sheath around a bundle of MMC laminates, heating the bundle of MMC laminates in the metallic sheath at a curing or fusing temperature to consolidate the bundle of MMC laminates into a single cured or fused part, and then cooling the cured or fused part. The bundle of MMC laminates may be formed by removing surface contamination from the dry reinforcement fibers, creating a plurality of individual MMC laminates by plating dry reinforcement fibers with electroless nickel, and/or electrodeposited nickel or cobalt, and stacking each of the plurality of individual MMC laminates into a bundle. Autocatalytic and/or electroplating may be used as the primary means to incorporate fiber reinforcement into the metal matrix composite by covering and bonding fiber reinforcement into MMC laminates/plies and/or 3-D woven parts.

A method of manufacturing metal matrix composite (MMC) parts, including the steps of applying a metallic sheath around a bundle of MMC laminates, heating the bundle of MMC laminates in the metallic sheath at a curing or fusing temperature to consolidate the bundle of MMC laminates into a single cured or fused part, and then cooling the cured or fused part. The bundle of MMC laminates may be formed by removing surface contamination from the dry reinforcement fibers, creating a plurality of individual MMC laminates by plating dry reinforcement fibers with electroless nickel, and/or electrodeposited nickel or cobalt, and stacking each of the plurality of individual MMC laminates into a bundle. Autocatalytic and/or electroplating may be used as the primary means to incorporate fiber reinforcement into the metal matrix composite by covering and bonding fiber reinforcement into MMC laminates/plies and/or 3-D woven parts.

Two-dimensional conductive nanoparticles may facilitate preparation of metal coatings prepared via electroless plating. Articles having a metal coating may comprise: a polymer body, and a metal coating on at least a portion of an outer surface of the polymer body. The metal coating comprises a plating metal and overlays a plurality of two-dimensional conductive nanoparticles and a catalyst metal.

An electrode, process for preparing the electrode and devices thereof. An electrode comprising at least one metal deposited on a substrate; and at least one electrically conducting polymer. The devices comprising the electrode for energy storage and molecular separation.

Atomic layer etching (ALE) enables effective filling of small feature structures on semiconductor and other substrates, such as contacts and vias, by bottom-up fill, for example electroless deposition (ELD) of cobalt.

A method for producing an alloy steel composition includes the following steps: performing a first heat treatment on an alloy steel composition and maintaining for a first time period to soften the alloy steel composition; performing a first cooling treatment on the softened alloy steel composition; performing a treatment on the softened the alloy steel composition to form a workpiece; performing a second heat treatment on the workpiece and maintaining for a second time period; and performing a second cooling treatment on the workpiece to make the workpiece become to be a Bainite structure, and a cooling rate of the second cooling treatment is high than the cooling rate of the first cooling treatment.

The present disclosure relates to disk separator plates that include a coating to increase the water contact angle of the exterior surface of the disk separator plate so as to decrease its wettability. The present disclosure also involves hard disk drives that include such a disk separator plate and related methods of forming such a coating.

The present disclosure relates to disk separator plates that include a coating to increase the water contact angle of the exterior surface of the disk separator plate so as to decrease its wettability. The present disclosure also involves hard disk drives that include such a disk separator plate and related methods of forming such a coating.

Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first lamination layer on a first side of a package substrate and a first surface finish on one or more electrical contacts disposed on a second side of the package substrate; removing the first lamination layer from the first side of the package substrate; depositing a second lamination layer on the second side of the package substrate and a second surface finish on the one or more electrical contacts disposed on the first side of the package substrate; and removing the second lamination layer from the second side of the package substrate. Other embodiments may be described and/or claimed.

Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first lamination layer on a first side of a package substrate and a first surface finish on one or more electrical contacts disposed on a second side of the package substrate; removing the first lamination layer from the first side of the package substrate; depositing a second lamination layer on the second side of the package substrate and a second surface finish on the one or more electrical contacts disposed on the first side of the package substrate; and removing the second lamination layer from the second side of the package substrate. Other embodiments may be described and/or claimed.