The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.

A new primer for electroless plating for use in the pretreatment process for electroless plating, which is environmentally friendly, can be easily treated in fewer process steps, and can provide sufficient adhesion to the substrate. A photocurable primer for forming a metal plating film on a base material through an electroless plating process, having (a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight average molecular weight of 1,000 to 5,000,000, (b) metal fine particles, (c) a polymerizable compound having a (meth)acryloyl group, and (d) a photopolymerization initiator.

An all solution-processed deposition includes a non-water soluble, non-self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), a water soluble, self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), cracking of the film, and filling the cracks with a metal that is deposited in solution (e.g., by electroless disposition). A transparent substrate having a cracked water insoluble, non-self-cracking film surface coating includes a plurality of fissures therein extending to and exposing portions of the surface of the underlying transparent substrate is useful for producing a transparent conducting film.

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I ##STR00001##
or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,
wherein D.sup.6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C.sub.1-C.sub.20 organic radical, D.sup.7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C.sub.2-C.sub.20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, R.sup.1 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.2, may form a divalent group D.sup.8, and R.sup.2 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.1, may form a divalent group D.sup.8, and D.sup.8 is selected from straight chain or branched C.sub.1-C.sub.18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, s is an integer from 1 to 250, R.sup.10 is selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I ##STR00001##
or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,
wherein D.sup.6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C.sub.1-C.sub.20 organic radical, D.sup.7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C.sub.2-C.sub.20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, R.sup.1 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.2, may form a divalent group D.sup.8, and R.sup.2 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.1, may form a divalent group D.sup.8, and D.sup.8 is selected from straight chain or branched C.sub.1-C.sub.18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, s is an integer from 1 to 250, R.sup.10 is selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.

One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.

The present invention discloses a bionic SERS substrate of a metal-based compound eye bowl structure, a construction method and application. The bionic SERS substrate of the metal-based compound eye bowl structure of the present invention consists of a metal bowl and a cone-shaped structure substrate in an ordered hierarchy manner. The metal bowl is of a continuously and closely arranged single-layer bowl structure. A height of the metal bowl is 0.01-10 μm, and a bowl opening diameter is 0.01-10 μm. A cone is a micron pyramid cone, and a height of the micron pyramid cone is 1-100 μm. The present invention assembles the metal bowl on a surface of the substrate of the micron pyramid cone structure with great fluctuation by a solid-liquid interface chemical reduction method and a small ball template method, and further constructs a 3D SERS substrate with a bionic compound eye structure.

The present invention discloses a bionic SERS substrate of a metal-based compound eye bowl structure, a construction method and application. The bionic SERS substrate of the metal-based compound eye bowl structure of the present invention consists of a metal bowl and a cone-shaped structure substrate in an ordered hierarchy manner. The metal bowl is of a continuously and closely arranged single-layer bowl structure. A height of the metal bowl is 0.01-10 μm, and a bowl opening diameter is 0.01-10 μm. A cone is a micron pyramid cone, and a height of the micron pyramid cone is 1-100 μm. The present invention assembles the metal bowl on a surface of the substrate of the micron pyramid cone structure with great fluctuation by a solid-liquid interface chemical reduction method and a small ball template method, and further constructs a 3D SERS substrate with a bionic compound eye structure.

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.