The present invention is to provide a plating film which can improve soldering bond reliability of solder bond against the accumulation of thermal history.

The present invention is a multilayer plating film comprising an electroless nickel-germanium alloy plating film; an electroless palladium plating film; and an electroless gold plating film in this order.

The present invention is to provide a plating film which can improve soldering bond reliability of solder bond against the accumulation of thermal history.

The present invention is a multilayer plating film comprising an electroless nickel-germanium alloy plating film; an electroless palladium plating film; and an electroless gold plating film in this order.

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines an input axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet and a base layer underlying the platform layer. The outer ring overlies the base layer. An inner portion of the outer ring faces the magnet assembly and an outer portion of the outer ring is configured to couple to an outer radial portion of a proof mass assembly. The pole piece and the platform layer include a high magnetic permeability material.

The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines an input axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet and a base layer underlying the platform layer. The outer ring overlies the base layer. An inner portion of the outer ring faces the magnet assembly and an outer portion of the outer ring is configured to couple to an outer radial portion of a proof mass assembly. The pole piece and the platform layer include a high magnetic permeability material.

Provided is a method for forming a metal film capable of forming a homogeneous metal film having a uniform film thickness by stably ensuring a fluid pressure of an electrolytic solution during film formation. The method places a substrate on a mount base. While sucking a gas between the substrate and a porous film through which the electrolytic solution can pass from a suction port of a suction passage formed on the mount base, the method brings the porous film into contact with the surface of the substrate. The method interrupts the suction passage while the porous film contacts the surface of the substrate. While interrupting the suction passage, the method allows the electrolytic solution to pass through the porous film while pressing the porous film against the surface of the substrate with a fluid pressure of the electrolytic solution and deposits metal from metal ions in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film.

The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) ##STR00001## wherein each X is independently an alkanediyl group; R.sup.1, R.sup.2, R.sup.3 and each R.sup.4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10.
The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.

A cathode is provided for electrolysis of water wherein the cathode material comprises a multi-principal element, transition metal dichalcogenide material that has four or more chemical elements and that is a single phase, solid solution. The pristine cathode material does not contain platinum as a principal (major) component. However, a cathode comprising a transition metal dichalcogenide having platinum (Pt) nanosized islands or precipitates disposed thereon is also provided.

A cathode is provided for electrolysis of water wherein the cathode material comprises a multi-principal element, transition metal dichalcogenide material that has four or more chemical elements and that is a single phase, solid solution. The pristine cathode material does not contain platinum as a principal (major) component. However, a cathode comprising a transition metal dichalcogenide having platinum (Pt) nanosized islands or precipitates disposed thereon is also provided.