The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

The present invention relates to a substrate comprising a plurality of integrally formed surface features, said surface features being micro-sized and/or nano-sized, said surface features comprising at least one pointed terminus. As a result of this unique surface, said substrate exhibits a biocidal activity because the terminal ends of said surface feature pierce through cell membrane of any microbial cell that comes into contact with the substrate, thereby causing cell deformation and lysis. The present invention also relates to a method producing said substrate. By a simple treatment of copper or zinc foil with a reagent solution comprising an alkali and an oxidizing agent, Cu(OH)2 nanotube arrays, CuO nano-blades and ZnO nano-needles are prepared. These surfaces are proven to be very effective in killing bacterial (such as E. coli) via a physical interaction.

The present invention relates to a substrate comprising a plurality of integrally formed surface features, said surface features being micro-sized and/or nano-sized, said surface features comprising at least one pointed terminus. As a result of this unique surface, said substrate exhibits a biocidal activity because the terminal ends of said surface feature pierce through cell membrane of any microbial cell that comes into contact with the substrate, thereby causing cell deformation and lysis. The present invention also relates to a method producing said substrate. By a simple treatment of copper or zinc foil with a reagent solution comprising an alkali and an oxidizing agent, Cu(OH)2 nanotube arrays, CuO nano-blades and ZnO nano-needles are prepared. These surfaces are proven to be very effective in killing bacterial (such as E. coli) via a physical interaction.

Provided is an electrically insulated component for use in a planar transformer. The insulated component may include a planar transformer conductive component having a first surface, a second surface and a plurality of edges. The insulated component may also include a first layer including an oxidized metal coating, as well as a second layer including an electrophoretically deposited (EPD) insulating coating. The EDP coating may include a polymer and an inorganic material. The first layer and the second layer may cover at least the first surface and the plurality of edges of the conductive component and the first layer may be disposed between the conductive component and the second layer. Also provided is a method of manufacturing of the electrically insulated component.

Provided is an electrically insulated component for use in a planar transformer. The insulated component may include a planar transformer conductive component having a first surface, a second surface and a plurality of edges. The insulated component may also include a first layer including an oxidized metal coating, as well as a second layer including an electrophoretically deposited (EPD) insulating coating. The EDP coating may include a polymer and an inorganic material. The first layer and the second layer may cover at least the first surface and the plurality of edges of the conductive component and the first layer may be disposed between the conductive component and the second layer. Also provided is a method of manufacturing of the electrically insulated component.